Senior AI & HPC Modeling Engineer

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise, ID is seeking a Senior Engineer to pioneer technology and AI advancements, focusing on VSM modeling across wafer, die, and package levels. You will collaborate with global teams and present predictive insights to engineers and senior leaders.

The role requires strong backgrounds in numerical methods, HPC, ML/AI, Linux, C++, Python, cloud platforms, and semiconductor experience. You will develop innovative modeling solutions and contribute to product development in a

Qualifications

• Master’s degree with 3+ years or PhD with 1+ years in a technical field.
• Strong knowledge of numerical methods, HPC, ML and AI algorithms.
• Experience with multiphysics and multiscale modeling and ML/DL libraries.
• Proficiency in Linux, C++, Python; experience in Cloud/HPC environments.
• Familiarity with SQL, data engineering, and cloud platforms (Azure, GCP, AWS).
• Exposure to semiconductor technologies or manufacturing.

Responsibilities

• Develop VSM/CM/DT models at wafer, die, and package levels across nodes.
• Collaborate with global teams to deploy advanced modeling solutions for design and product development.
• Apply diverse AI techniques to build robust models with sparse data.
• Identify insights from VSM and data and communicate findings to engineers and leaders.

Skills

Numerical methods

High Performance Computing

Machine learning

Artificial intelligence algorithms

Linux

C++

Python

Cloud platforms

SQL

Education

Master’s or PhD in Engineering/Applied Sciences/CS/EE

Tools

Linux

C++

Python

SQL

Azure

GCP

AWS

Job description

Micron Technology in Boise, ID is seeking a Senior Engineer to pioneer technology and AI advancements, focusing on VSM modeling across wafer, die, and package levels. You will collaborate with global teams and present predictive insights to engineers and senior leaders.

The role requires strong backgrounds in numerical methods, HPC, ML/AI, Linux, C++, Python, cloud platforms, and semiconductor experience. You will develop innovative modeling solutions and contribute to product development in a