Semiconductor Teardown & Architecture Analyst

SemiAnalysis; Hillsboro (OR); On-site; USD 120,000 - 180,000; Full time

Job summary

SemiAnalysis is scaling STEEL, our semiconductor teardown and characterization lab in Hillsboro, Oregon, to support deep research into AI and datacenter hardware. We are hiring a Competitive Analysis Engineer (Semiconductor Manufacturing & Architecture) for hands-on teardown, imaging, and analysis of cutting-edge devices.

You will work across the full lifecycle from sample prep to data interpretation, translating observations into defensible conclusions on process technology, integration

Qualifications

• 3+ years of semiconductor-related experience including FEOL/BEOL
• Experience with advanced packaging integration and DTCO
• Strong technical writing and ability to build structured arguments

Responsibilities

• Conduct end-to-end teardown and characterization of AI and datacenter hardware from package to transistor level
• Operate tools such as FIB and SEM for sample prep and analysis
• Interpret imaging data to derive insights on process integration, materials, and design trade-offs
• Document FEOL, BEOL, and advanced packaging trends across foundries, memory vendors, and OSATs
• Identify tech shifts, competitive positioning, and trade-offs in manufacturing approaches
• Co-author publications and translate findings into clear narratives for technical audiences
• Contribute to lab capability development and analytical coverage

Skills

Technical writing

Analytical thinking

Ownership mindset

Tools

FIB

SEM

Job description

SemiAnalysis is scaling STEEL, our semiconductor teardown and characterization lab in Hillsboro, Oregon, to support deep research into AI and datacenter hardware. We are hiring a Competitive Analysis Engineer (Semiconductor Manufacturing & Architecture) for hands-on teardown, imaging, and analysis of cutting-edge devices.

You will work across the full lifecycle from sample prep to data interpretation, translating observations into defensible conclusions on process technology, integration