AI Datacenter Hardware Architect — Teardown & Analysis

SemiAnalysis; Hillsboro (OR); On-site; USD 90,000 - 130,000; Full time

Job summary

SemiAnalysis in Hillsboro, OR is seeking an experienced Hardware Engineer or Architect to join our team. You will analyze AI and datacenter hardware architectures, dissect performance and manufacturing choices, and translate findings into actionable insights for our research reports.

You will conduct teardown and characterization of GPUs, CPUs, accelerators, and high-speed I/O, apply DTCO/STCO reasoning, and co-author technical research.

Qualifications

• 3+ years in hardware architecture, product design, silicon engineering, post-silicon debug, or closely equivalent.
• Strong functional knowledge of AI and datacenter hardware architecture (GPUs, CPUs, accelerators).
• Direct experience in physical or electrical failure analysis, fault isolation, device debug, or related physical root-cause work.
• Understanding of Design Technology Co-Optimization (DTCO) principles.
• Hands-on experience with semiconductor sample preparation and analytical tools — precision polishing, FIB, SEM, and related methods.

Responsibilities

• Conduct detailed architectural analysis of AI and datacenter hardware — GPUs, ASICs, CPUs, custom accelerators, high-speed I/O, memory subsystems.
• Drive end-to-end teardown and characterization; operate the analytical toolchain.
• Identify competitive advantages, disadvantages, and generational changes in hardware design and system decisions.
• Apply DTCO/STCO reasoning to interpret architectural trade-offs and process-design interactions.
• Co-author technical research published by SemiAnalysis; document findings in clear, precise language.
• Contribute to growth of the lab's capabilities and collaboration with a global team.

Skills

Hardware architecture

AI hardware

Device debug

DTCO/STCO

Semiconductor analysis

Tools

FIB

SEM

X-ray

Polishing

Job description

SemiAnalysis in Hillsboro, OR is seeking an experienced Hardware Engineer or Architect to join our team. You will analyze AI and datacenter hardware architectures, dissect performance and manufacturing choices, and translate findings into actionable insights for our research reports.

You will conduct teardown and characterization of GPUs, CPUs, accelerators, and high-speed I/O, apply DTCO/STCO reasoning, and co-author technical research.