Semiconductor Manufacturing & Architecture Analyst

SemiAnalysis; Hillsboro (OR); On-site; USD 120,000 - 180,000; Full time

Job summary

SemiAnalysis is scaling STEEL, our semiconductor teardown and characterization lab in Hillsboro, Oregon, to support deep research into AI and datacenter hardware. We are hiring a Competitive Analysis Engineer (Semiconductor Manufacturing & Architecture) for hands-on teardown, imaging, and analysis of cutting-edge devices.

You will work across the full lifecycle from sample prep to data interpretation, translating observations into defensible conclusions on process technology, integration

Qualifications

• 3+ years of semiconductor-related experience including FEOL/BEOL
• Experience with advanced packaging integration and DTCO
• Strong technical writing and ability to build structured arguments

Responsibilities

• Conduct end-to-end teardown and characterization of AI and datacenter hardware from package to transistor level
• Operate tools such as FIB and SEM for sample prep and analysis
• Interpret imaging data to derive insights on process integration, materials, and design trade-offs
• Document FEOL, BEOL, and advanced packaging trends across foundries, memory vendors, and OSATs
• Identify tech shifts, competitive positioning, and trade-offs in manufacturing approaches
• Co-author publications and translate findings into clear narratives for technical audiences
• Contribute to lab capability development and analytical coverage

Skills

Technical writing

Analytical thinking

Ownership mindset

Tools

FIB

SEM

Job description

Work hours: Office hours

Find out more here: https://semianalysis.com

About SemiAnalysis

SemiAnalysis is an independent research and analysis firm specializing in the Semiconductor and AI industries. Our in-depth coverage spans the entire supply chain, from semiconductor fabrication processes to cutting-edge AI Models, software, and infrastructure. We are recognized as the leading authority on the semiconductor supply chain, with the highest concentration of industry experts within one team, and a deep-rooted passion for delving into the intricacies.

We’re a global team of over 50 analysts, each with extensive networks across the semiconductor supply chain and AI ecosystem, publishing industry-shaping articles while participating in 40+ conferences annually.

Our newsletter reaches more than 200 000 subscribers worldwide, including senior management and C-suite leaders at the leading semiconductor and AI companies.

We also offer three core products:

• Industry Models - we develop and publish industry models on accelerator shipments, datacenter demand and supply, GPU total cost of ownership, and more. We work with hyperscalers, neoclouds, many of the world’s largest hedge funds, and government agencies.
• Core Research - our public equity markets product, geared towards financial investors, distills our deep technical research and knowledge into key insights on technology and product trends.
• Consulting and Technical Due Diligence - We conduct custom research and project work to guide key strategic and investment decisions for the largest private-equity funds, leading venture-capital firms, companies across the AI and semiconductor ecosystem, and government agencies.

Position Overview

SemiAnalysis is scaling STEEL, our semiconductor teardown and characterization lab in Hillsboro, Oregon, to support deep research into the hardware shaping the AI and datacenter industry.

We are hiring a Competitive Analysis Engineer (Semiconductor Manufacturing & Architecture). This is a highly hands‑on role focused on generating evidence‑based technical insights through physical teardown, imaging, and analysis of leading‑edge hardware.

You will work across the full lifecycle, from sample preparation to data interpretation, translating physical observations into clear, defensible conclusions on process technology, integration strategies, and design intent.

This role is ideal for individuals driven by curiosity, investigation, and technical rigor, with the ability to connect microscopic evidence to macro‑level industry decisions. You will operate as a subject matter authority on current and next‑generation semiconductor manufacturing for AI and datacenter systems.

Responsibilities

• Conduct end‑to‑end teardown and characterization of AI and datacenter hardware, spanning package -> die -> transistor level
• Perform hands‑on sample preparation and analysis, including operating tools such as FIB, SEM, and related characterization equipment
• Interpret imaging and analytical data to derive insights on process integration, materials, and design trade‑offs
• Analyze and document FEOL, BEOL, and advanced packaging trends across foundries, memory vendors, and OSATs
• Identify generational technology shifts, competitive positioning, and trade‑offs in manufacturing approaches
• Apply Design Technology Co-Optimization (DTCO) principles to explain design/process decisions, cost implications, and performance outcomes
• Produce high‑quality technical research and written analysis, co‑authoring publications for SemiAnalysis clients
• Translate complex physical findings into clear, structured, and defensible narratives for a technical audience
• Contribute to the development and expansion of lab capabilities, workflows, and analytical coverage

Requirements

• 3+ years of experience in semiconductor-related roles, including:
• Process integration (FEOL / BEOL)
• Advanced packaging integration
• Silicon / hardware engineering
• OR a closely related domain with exposure to leading‑edge nodes
• Broad process familiarity across:
• Memory technologies (e.g., HBM, GDDR, 3D NAND)
• Strong understanding of:
• Process integration and product architecture
• Design Technology Co-Optimization (DTCO) principles
• Demonstrated ability to:
• Reason from physical / structural evidence -> process & design intent
• Distinguish between real signals vs artifacts in analysis
• Hands‑on experience or strong aptitude in:
• Analytical tools such as FIB, SEM, and related techniques
• Core competencies:
• Strong technical writing and structured argumentation
• High curiosity, ownership, and investigative mindset
• Ability to work independently and close analytical loops end‑to‑end

Nice to Have

• Experience with advanced characterization techniques:
• TEM / STEM
• EDS / WDS
• EELS
• SIMS
• Atom Probe Tomography (APT)
• Exposure to:
• Advanced packaging R&D (2.5D / 3D integration, hybrid bonding, high-speed interconnects)
• Failure analysis & fault isolation (nanoprobing, emission microscopy, laser/e-beam methods)
• Proven ability to:
• Interpret micrographs and compositional data to infer process/design characteristics
• Python for image analysis, data processing, or lab automation
• Established industry network across semiconductor ecosystem (foundries, memory vendors, packaging players)

Growth Areas

This role offers strong upside into both technical depth and industry influence:

• Develop into a recognized authority in semiconductor manufacturing and architecture, particularly for AI/datacenter hardware
• Contribute directly to industry-shaping research and thought leadership published by SemiAnalysis
• Gain exposure to cutting‑edge technologies and competitive strategies across global semiconductor leaders
• Grow into a lead contributor or domain specialist within STEEL lab capabilities (e.g., packaging, memory, process nodes)
• Opportunity to influence research direction, lab investments, and analytical frameworks

SemiAnalysis LLC participates in the E-Verify program to confirm the employment eligibility of all newly hired employees. For more information, visit e-verify.gov.

• Right to Work Poster: https://www.justice.gov/crt/case-document/file/1133936/dl?inline=