Semiconductor Process Engineer - Grinding & CMP Specialist

Apex Microdevices

Los Angeles (CA)

On-site

USD 65,000 - 90,000

Full time

4 days ago
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Job summary

Apex Microdevices in Los Angeles, California, seeks an entry-level Semiconductor Process Engineer to advance heterogeneous materials integration and next-generation devices. You will work hands-on in grinding, lapping, CMP, and materials processing.

This role emphasizes experimental documentation, collaboration in a multidisciplinar y R&D team, and staying current with industry advances in engineered substrates for electronic, photonic, and quantum technologies.

Qualifications

  • BS or higher in Physics, Chemistry, Materials Science & Engineering, Electrical Engineering, or related field.
  • 0–3 years of professional research experience is typical.
  • Detail-oriented with good documentation skills.
  • Ability to work in a multidisciplinary R&D team.

Responsibilities

  • Support process development for heterogeneous integration of dissimilar materials.
  • Develop grinding, lapping, and CMP processes for semiconductor materials.
  • Evaluate new grinding methods and CMP slurries.
  • Troubleshoot grinding, lapping, and polishing challenges.
  • Apply surface mechanics and chemistry knowledge to materials-processing challenges.
  • Characterize substrates and thin films using XRD, XRR, AFM, SEM, TEM.
  • Document experiments, process conditions, results, and findings.
  • Collaborate with researchers and engineers in a multidisciplinary R&D environment.
  • Stay current with industry developments in semiconductor grinding and polishing.

Skills

Attention to detail
Documentation
Team collaboration
Scientific mindset

Education

BS or higher in Physics, Chemistry, Materials Science & Engineering, Electrical Engineering, or related field

Tools

XRD
XRR
AFM
SEM
TEM
Grinding
CMP

Job description

Apex Microdevices in Los Angeles, California, seeks an entry-level Semiconductor Process Engineer to advance heterogeneous materials integration and next-generation devices. You will work hands-on in grinding, lapping, CMP, and materials processing.

This role emphasizes experimental documentation, collaboration in a multidisciplinar y R&D team, and staying current with industry advances in engineered substrates for electronic, photonic, and quantum technologies.

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