Semiconductor Process Engineer

Apex Microdevices; Los Angeles (CA); On-site; USD 65,000 - 90,000; Full time

Job summary

Apex Microdevices in Los Angeles, California, seeks an entry-level Semiconductor Process Engineer to advance heterogeneous materials integration and next-generation devices. You will work hands-on in grinding, lapping, CMP, and materials processing.

This role emphasizes experimental documentation, collaboration in a multidisciplinar y R&D team, and staying current with industry advances in engineered substrates for electronic, photonic, and quantum technologies.

Qualifications

• BS or higher in Physics, Chemistry, Materials Science & Engineering, Electrical Engineering, or related field.
• 0–3 years of professional research experience is typical.
• Detail-oriented with good documentation skills.
• Ability to work in a multidisciplinary R&D team.

Responsibilities

• Support process development for heterogeneous integration of dissimilar materials.
• Develop grinding, lapping, and CMP processes for semiconductor materials.
• Evaluate new grinding methods and CMP slurries.
• Troubleshoot grinding, lapping, and polishing challenges.
• Apply surface mechanics and chemistry knowledge to materials-processing challenges.
• Characterize substrates and thin films using XRD, XRR, AFM, SEM, TEM.
• Document experiments, process conditions, results, and findings.
• Collaborate with researchers and engineers in a multidisciplinary R&D environment.
• Stay current with industry developments in semiconductor grinding and polishing.

Skills

Attention to detail

Documentation

Team collaboration

Scientific mindset

Education

BS or higher in Physics, Chemistry, Materials Science & Engineering, Electrical Engineering, or related field

Tools

XRD

XRR

AFM

SEM

TEM

Grinding

CMP

Job description

Semiconductor Process Engineer

Apex Microdevices | Los Angeles, California

Apex Microdevices is seeking an early-career Semiconductor Process Engineer to support the development of next-generation heterogeneously integrated materials platforms and engineered substrates. The position will contribute to advanced research and development programs focused on materials technologies for future electronic, photonic, and quantum devices.

This is a hands-on research and development position focused on grinding, lapping, chemical mechanical polishing (CMP), semiconductor materials processing, and materials characterization.

Examples of engineered substrate technologies relevant to this work include Silicon Carbide on Insulator (SiCOI) and Lithium Niobate on Insulator (LNOI).

What You'll Do

• Support process development for the heterogeneous integration of dissimilar materials.
• Develop and perform grinding, lapping, and chemical mechanical polishing (CMP) processes for technologically relevant semiconductor materials.
• Evaluate and benchmark new grinding methods and CMP slurries.
• Investigate grinding, lapping, and polishing challenges and conduct detailed troubleshooting to identify and implement corrective actions.
• Apply knowledge of surface mechanics and surface chemistry to semiconductor materials-processing challenges.
• Characterize substrates and thin films using techniques such as XRD, XRR, AFM, SEM, TEM , as applicable.
• Accurately document experiments, process conditions, results, and technical findings.
• Work collaboratively with researchers and engineers in a multidisciplinary R&D environment.
• Stay current with relevant industry developments and state-of-the-art approaches in semiconductor grinding and polishing.

Why This Role

This position offers the opportunity to:

• Work on advanced engineered substrate and heterogeneous integration technologies.
• Gain hands-on experience with semiconductor grinding, lapping, CMP, and materials characterization.
• Contribute to research supporting future electronic, photonic, and quantum technologies.
• Develop technical expertise through practical semiconductor materials and process-development work.
• Work in a collaborative R&D environment addressing emerging materials-processing challenges.

Minimum Qualifications

• BS or higher degree in Physics, Chemistry, Materials Science & Engineering, Electrical Engineering, or a closely related science or engineering field.
• Entry level or approximately 0–3 years of professional research experience.
• Strong attention to detail and ability to follow experimental and process instructions accurately.
• Ability to generate accurate documentation of experimental results and technical reports.
• Ability to work effectively as part of a collaborative technical team.
• U.S. citizenship is required.
• Must be able to pass a post-employment background investigation.

Preferred Qualifications

Experience or knowledge in one or more of the following areas is desirable:

• Grinding, lapping, or chemical mechanical polishing (CMP).
• Surface mechanics and surface chemistry.
• Physical and morphological characterization of substrates and thin films.
• Characterization techniques including XRD, XRR, AFM, SEM, or TEM.
• Semiconductor processing.
• Cleanroom laboratory environments.
• Evaluation of grinding methods or CMP slurries.
• Troubleshooting and corrective action for grinding, lapping, or polishing processes.

About Apex Microdevices

Apex Microdevices supports advanced semiconductor materials research and development, including programs focused on engineered substrates and heterogeneous materials integration. The company works across multiple sponsored R&D efforts addressing emerging materials and process challenges for advanced electronic, photonic, and quantum technologies.

Position Details

Position: Semiconductor Process Engineer
Location: Los Angeles, California
Experience Level: Entry Level / 0–3 Years
Education: BS or higher degree in a relevant science or engineering discipline
Citizenship: U.S. citizenship required