Semiconductor Packaging Process Engineer — NPI & Wire Bonding

Luminus Devices; Sunnyvale (CA); On-site; USD 90,000 - 125,000; Full time

Job summary

Luminus Devices in Sunnyvale, CA is seeking a Process Engineer with a strong background in semiconductor packaging to advance high power LED products. The role blends process engineering with leading New Product Introduction, with emphasis on wire bonding, die attach and dispensing.

You will collaborate with contract manufacturers in Asia, manage projects end-to-end, and drive cost/performance improvements while traveling up to 20% as needed.

Qualifications

• Strong background in semiconductor packaging.
• Role combines process engineering with New Product Introduction (NPI).
• Emphasis on wire bonding, die attach and dispensing.

Responsibilities

• Collaborate with contract manufacturers in Asia.
• Manage projects and drive cost/performance improvements.
• Travel up to 20% as needed.

Skills

Semiconductor packaging

Wire bonding

Die attach

Dispensing

Job description

Luminus Devices in Sunnyvale, CA is seeking a Process Engineer with a strong background in semiconductor packaging to advance high power LED products. The role blends process engineering with leading New Product Introduction, with emphasis on wire bonding, die attach and dispensing.

You will collaborate with contract manufacturers in Asia, manage projects end-to-end, and drive cost/performance improvements while traveling up to 20% as needed.