Semiconductor Packaging Co-Op: Hands-on Microelectronics

Skyworks Solutions, Inc; Nashua (NH); On-site; USD 36,000 - 65,000; Full time

Job summary

Skyworks Solutions, Inc in Nashua is seeking a Microelectronics/Semiconductor Packaging Co-Op/Intern for a Winter/Spring 2027 term, January to June 2027. You will gain hands-on experience in packaging technologies, materials evaluation, process development, failure analysis, and data analysis.

The role involves collaborating with packaging, manufacturing, quality, and design engineers, plus external OSAT partners to optimize packaging solutions for high-performance electronics.

Qualifications

• Pursuing a Bachelor's or Master's degree in engineering fields
• Junior or Senior standing or graduate student status
• Strong analytical, problem-solving, and communication skills
• Proficiency with Microsoft Office applications (Excel, Word, PowerPoint)
• Ability to work independently and as part of a team

Responsibilities

• Support packaging development and manufacturing projects
• Evaluate and characterize packaging materials
• Assist with package assembly process development and documentation
• Conduct laboratory experiments and engineering studies
• Collect, analyze, and present technical data for engineering decisions
• Assist with failure analysis investigations and DOE activities
• Create and maintain engineering docs, test plans, specs, and instructions
• Collaborate with cross-functional teams and OSAT partners
• Maintain accurate engineering records and safety compliance

Skills

Analytical skills

Problem-solving

Communication skills

MS Office (Excel, Word, PowerPoint)

Team collaboration

Education

Bachelor's or Master's degree in Mechanical, Chemical, Materials, Industrial, Electrical, or Electronics and Computer Engineering

Junior or Senior standing or graduate student

Tools

SolidWorks

Creo

AutoCAD

Job description

Skyworks Solutions, Inc in Nashua is seeking a Microelectronics/Semiconductor Packaging Co-Op/Intern for a Winter/Spring 2027 term, January to June 2027. You will gain hands-on experience in packaging technologies, materials evaluation, process development, failure analysis, and data analysis.

The role involves collaborating with packaging, manufacturing, quality, and design engineers, plus external OSAT partners to optimize packaging solutions for high-performance electronics.