Semiconductor Module Engineering Intern (PhD) — 2027

Intel; Hillsboro (AL); On-site; USD 121,000 - 122,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Vacation

Job summary

Intel in Hillsboro, Oregon is seeking a Module Engineering Intern to join the F25 Metals team, working with engineers, technicians and operations to support high-volume manufacturing of advanced semiconductor technologies and deliver a meaningful project.

The internship offers hands-on experience in process improvement, data analytics, and cross-functional collaboration, with mentoring and networking to prepare for future full-time opportunities at Intel.

Qualifications

• Pursuing a PhD in a technical field with GPA ≥3.0.
• Available for a 10–12 week summer internship.
• Experience in semiconductor processing or a related field.

Responsibilities

• Lead a project from problem definition through execution and final presentation
• Analyze manufacturing, equipment, and operational data to support decision making
• Apply structured problem-solving and continuous improvement methodologies
• Collaborate with engineers, technicians, quality teams, and operational stakeholders
• Develop technical communication and presentation skills
• Gain exposure to advanced semiconductor manufacturing technologies and operations

Skills

Data analytics

Python

MATLAB

Power BI

Excel

SQL

Problem-solving

Communication

Cross-functional collaboration

Education

PhD in Electrical/ Chemical/ Materials Science or Physics

Tools

JMP

Job description

Intel in Hillsboro, Oregon is seeking a Module Engineering Intern to join the F25 Metals team, working with engineers, technicians and operations to support high-volume manufacturing of advanced semiconductor technologies and deliver a meaningful project.

The internship offers hands-on experience in process improvement, data analytics, and cross-functional collaboration, with mentoring and networking to prepare for future full-time opportunities at Intel.