Equipment Engineer, Texas Institute for Electronics

The University of Texas at Austin; Austin (TX); On-site; USD 70,000 - 100,000; Full time

Benefits offered by this job

Competitive health benefits

Voluntary Vision, Dental, Life, and Disability insurance options

Generous paid vacation, sick time, and holidays

Tuition assistance

Employee discount program

Job summary

The University of Texas at Austin is hiring for the position of Equipment Engineer at the Texas Institute for Electronics. This role involves ensuring equipment effectiveness in semiconductor processes, with responsibilities including installation management, compliance, and more.

Candidates should have a Bachelor's degree in engineering and a minimum of three years of experience in the semiconductor industry. Competitive health benefits and opportunities for professional development are provided.

Qualifications

• Three years of engineering experience in a semiconductor fab or packaging facility.
• Relevant education and experience may be substituted as appropriate.

Responsibilities

• Drive and approve installation packages.
• Manage MEP schedule and installation.
• Ensure safety compliance.
• Oversee subcontractors.
• Create and maintain equipment specifications.

Skills

Equipment installation project management

Statistical process control

Interpersonal communication

Adaptability

Education

Bachelor's degree in engineering

Job description

Job Posting Title

Equipment Engineer, Texas Institute for Electronics

Hiring Department

Texas Institute for Electronics

Position Open To

All Applicants

Weekly Scheduled Hours

40

FLSA Status

To Be Determined at Offer

Earliest Start Date

Ongoing

Position Duration

Expected to Continue

Location

PICKLE RESEARCH CAMPUS

Job Details

Must be eligible to work in the United States on a full‑time basis for any employer without sponsorship.

About Us

The Texas Institute for Electronics (TIE) is a University of Texas at Austin‑supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state‑of‑the‑art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting‑edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more.

Benefits

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Purpose

This position’s primary function is to ensure the overall equipment effectiveness of semiconductor and packaging process equipment in our fabs. We are filling positions for equipment engineers in these functional equipment areas: lithography, high‑vacuum plasma, wet processing, mechanical processing, and metrology and inspection. Equipment engineers will be responsible for equipment installation, the creation of equipment maintenance procedures and schedules, parts‑and‑kit selection‑or‑creation. Equipment engineers will work closely with process tool owners and integration engineers to ensure we are driving fast cycles of learning in semiconductor advanced packaging.

Each equipment engineer will be responsible for one of these functional groups of equipment. TIE is filling one position per functional area.

• Lithography: Coat tracks, Steppers, Litho‑specific metrology
• High‑Vacuum Plasma: CVD, Etch, Plasma Dicing, PVD
• Wet Processing: Batch cleaning, single wafer cleaning, plating
• Mechanical Processes: CMP, Grinding, Dicing, Bonding
• Metrology and Inspection: SEM, Defect Inspection, Film Thickness, Microscopes

Responsibilities

• Drive and approve installation packages
• Manage MEP schedule and installation
• Ensure safety compliance
• Managing acquisition and installation of pedestals, VMBs, LDS, process piping, exhaust, drains and related items
• Oversee subcontractors
• Create and maintain equipment specifications
• Maintain SPC charts, including reacting to trends
• Develop technician training plans
• Develop maintenance checklists and schedules
• Develop process kits
• Maintain equipment dashboards and OEE analysis reports
• Participate in or drive tool selections, equipment procurement, upgrade planning, parts management
• Perform other related functions as assigned

Required Qualifications

• Bachelor’s degree in an engineering discipline, such as electrical, chemical, or mechanical, or similar related technical field
• Three years of engineering experience in a semiconductor fab or semiconductor advanced packaging facility
• Equipment installation project management experience
• Statistical process control experience
• Ability to work independently and excellent interpersonal communication and written skills
• Dependable, stable under pressure, and able to adapt to change

Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• Five or more years of semiconductor equipment engineering
• Master’s degree or higher

Salary Range

TIE pays industry competitive salaries.

Working Conditions

• Job duties may be performed in a clean room environment, in awkward positions and/or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds may be required.
• May require bending, stooping, crawling, climbing and use of PPE.
• May work around chemical fumes, biohazards, chemicals, electrical and mechanical hazards.
• May be required to work in confined spaces, tunnels, on elevated platforms.

Required Materials

• Resume/CV
• Three work references with their contact information; at least one reference should be from a supervisor
• Letter of interest

Equal Opportunity Employer

The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.