Semiconductor Diffusion/Implant/RTP Process Engineer

Micron Technology, Inc.; Manassas (VA); On-site; USD 74,000 - 183,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Equity

Job summary

Micron Technology, Inc. in Manassas, Virginia is seeking a Process Engineer to own diffusion, implantation, and RTP processes in a high-volume fab.

You start with a structured training plan and progress toward full ownership while using SPC and FDC data to drive improvements and high-quality die output. You will collaborate with PIE, Yield, Defect/Metrology, Equipment Engineering, and Manufacturing; perform DOE and root-cause analysis; contribute to process capability, yield, and cost

Qualifications

• Master’s degree in a related engineering field.
• 0–2 years of semiconductor process engineering or related experience.
• Understanding of semiconductor fabrication processes and device physics.
• Experience designing experiments and analyzing engineering data with statistics.

Responsibilities

• Own and sustain assigned diffusion, implant, and RTP processes; monitor SPC, FDC, parameters, recipes, and specifications.
• Investigate process excursions using root-cause analysis and DOE; partner with PIE, Yield, Defect/Metrology, and Equipment Engineering.
• Improve process capability and yield by designing experiments, analyzing data, and applying BKMs.
• Support new equipment installations, qualifications, and change-control documentation.
• Maintain accurate process and training documentation and follow Micron requirements.

Skills

Diffusion

Ion Implantation

RTP

DOE

Statistical Process Control

Data analysis

Root cause analysis

DOE (Design of Experiments)

Education

Master’s degree in Materials Science

Master’s degree in Chemical Engineering

Master’s degree in Physics

Master’s degree in Electrical Engineering

Job description

Micron Technology, Inc. in Manassas, Virginia is seeking a Process Engineer to own diffusion, implantation, and RTP processes in a high-volume fab.

You start with a structured training plan and progress toward full ownership while using SPC and FDC data to drive improvements and high-quality die output. You will collaborate with PIE, Yield, Defect/Metrology, Equipment Engineering, and Manufacturing; perform DOE and root-cause analysis; contribute to process capability, yield, and cost