RF Mechanical Packaging Engineer

Microwave Products Group; Salisbury (MD); On-site; USD 85,000 - 100,000; Full time

Benefits offered by this job

401(k) plan with employer contribution

Medical, dental, and vision insurance

Tuition assistance

Paid time off and holidays

Job summary

Microwave Products Group in Salisbury, MD is seeking an electro-mechanical packaging engineer to design high-performance RF device enclosures. You will use 3D CAD to create assemblies, analyze thermal and mechanical stresses, and develop PCB layouts for airborne, maritime, and ground-mobile systems.

The role requires a BS or MS in mechanical engineering with 2+ or 3+ years of related experience, respectively, and US person status.

Qualifications

• Requires US Person (citizen or green card holder).
• Bachelor’s degree in mechanical engineering with 2+ years of relevant experience, or MS with 3+ years of relevant experience.
• Experience with 3D CAD software is required.
• Experience with MIL-STD testing and IPC standards is preferred.
• Knowledge of thermal and structural analysis and electro-mechanical packaging is required.

Responsibilities

• Design high performance electro-mechanical packaging for RF devices and enclosures.
• Create detail drawings and BOMs; update engineering documentation.
• Perform thermal, mechanical stress, and vibration analysis on enclosures and PCBs.
• Conduct air flow calculations (lb/min, mass/volume flow, velocity, pressure drop) under varying conditions.
• Support new program proposals and mentor other mechanical designers.

Skills

Thermal analysis

Structural analysis

3D CAD

NASTRAN

AutoDesk Inventor

AutoCAD

PCB layout

MIL-STD testing

IPC standards

DoD security clearance

Education

Bachelor’s degree in Mechanical Engineering

MS in Mechanical Engineering

Tools

AutoDesk Inventor

AutoCAD

Job description

Microwave Products Group in Salisbury, MD is seeking an electro-mechanical packaging engineer to design high-performance RF device enclosures. You will use 3D CAD to create assemblies, analyze thermal and mechanical stresses, and develop PCB layouts for airborne, maritime, and ground-mobile systems.

The role requires a BS or MS in mechanical engineering with 2+ or 3+ years of related experience, respectively, and US person status.