RF Mechanical Engineer - Thermal & Enclosure Design

Dover-Corporation

Salisbury (MD)

On-site

USD 85,000 - 100,000

Full time

5 days ago
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Job summary

Dover Corporation’s Microwave Products Group (MPG) in Salisbury, MD, seeks a design engineer to advance electro-mechanical packaging for RF devices. You will design high-performance mechanical assemblies for housing PCBs and components, and leverage CAD tools to solve thermal and stress challenges in aerospace/industrial applications.

Proficiency with AutoDesk Inventor/AutoCAD, PCB layout software, and IPC/MIL standards is expected, along with strong communication across engineering,

Qualifications

  • Bachelor’s degree in mechanical engineering with 2+ years of relevant experience or MS with 3+ years of relevant experience.
  • Experience in thermal and structural analysis and electro-mechanical packaging.

Responsibilities

  • Design high-performance mechanical assemblies and support production.
  • Design structures for housing PCBs and electronic components.
  • Conduct thermal, mechanical stress, and vibration analyses of enclosures and PCBs.
  • Perform air flow calculations for thermal management.
  • Create PCB/PCBA designs per IPC-2221 and generate BOMs and drawings.
  • Maintain documentation and assist root-cause analysis.

Skills

Thermal analysis
Structural analysis
Electro-mechanical packaging
Communication
Documentation

Education

Bachelor's degree in mechanical engineering
MS in mechanical engineering

Tools

AutoDesk Inventor
AutoCAD
PCB layout software
3D CAD software

Job description

Dover Corporation’s Microwave Products Group (MPG) in Salisbury, MD, seeks a design engineer to advance electro-mechanical packaging for RF devices. You will design high-performance mechanical assemblies for housing PCBs and components, and leverage CAD tools to solve thermal and stress challenges in aerospace/industrial applications.

Proficiency with AutoDesk Inventor/AutoCAD, PCB layout software, and IPC/MIL standards is expected, along with strong communication across engineering,

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