RF Chiplet Design Engineer — 100+ GHz Interposers

imec USA

Kissimmee (FL)

On-site

USD 110,000 - 170,000

Full time

30 hours ago
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Job summary

imec USA’s Kissimmee, Florida-based R&D Center develops advanced RF interposer technologies for >100 GHz and >100 Gbps systems. Design Engineer will co-design CMOS/III-V chiplets, run simulations, and tape out circuits to meet stringent performance and manufacturability requirements.

You will work with teams in Kissimmee and Leuven, Belgium, collaborating with customers and partners to advance RF heterogeneous integration toward real-world applications.

Qualifications

  • You hold a PhD or a Master’s degree with at least 3 years of relevant experience in electrical engineering or microelectronics.
  • Proficient in Cadence Virtuoso for CMOS chiplet design and tapeout.
  • Experience with Keysight ADS and Ansys HFSS or similar RF/electromagnetic tools.
  • Strong understanding of high-frequency (>100 GHz) and high-speed (>100 Gbps) chiplet design.
  • Strong written and verbal English, able to collaborate across teams.
  • U.S. person status is preferred.

Responsibilities

  • Design RF building blocks and circuits for phase shifters, multipliers, power amplifiers, and PLLs.
  • Use EM simulation to extract parasitics and guide co-design of interposer and chiplets.
  • Design and tape out CMOS and III-V circuits using Cadence Virtuoso and RF tools.
  • Collaborate with imec teams in the US and Belgium and with partners.
  • Contribute to technical publications and test vehicles.

Skills

RF circuit design
Interposer design
Co-design collaboration
English communication

Education

PhD or Master’s degree in Electrical Engineering

Tools

Cadence Virtuoso
Keysight ADS
Ansys HFSS

Job description

imec USA’s Kissimmee, Florida-based R&D Center develops advanced RF interposer technologies for >100 GHz and >100 Gbps systems. Design Engineer will co-design CMOS/III-V chiplets, run simulations, and tape out circuits to meet stringent performance and manufacturability requirements.

You will work with teams in Kissimmee and Leuven, Belgium, collaborating with customers and partners to advance RF heterogeneous integration toward real-world applications.

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