Remote ECAD Layout Technician - PCB Draft & Definition

globalhr

Iowa (LA)

Remote

USD 41,000 - 73,000

Full time

8 days ago
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Benefits offered by this job

Medical, dental, and vision insurance
Vacation time and 401(k) plans
Tuition reimbursement
Employee assistance program
Wellness programs

Job summary

Collins Aerospace is seeking a remote PCB layout specialist to contribute to ECAD tasks under senior guidance. You will apply standard ECAD workflows, place components, perform basic routing, and help generate fabrication outputs.

You will learn advanced Xpedition features, multilayer stackups, DFM concepts, and cross‑functional reviews with Electrical, Mechanical, and Manufacturing teams.

Qualifications

  • Typically requires HS Diploma or AA/AS degree with a minimum of 2 years of PCB layout experience.
  • Experience with PCB layout using ECAD tools, including Siemens Xpedition.
  • Ability to place, route, and manage basic ECAD constraints on multilayer designs.
  • Familiarity with fabrication outputs such as Gerbers/ODB++.
  • Understanding of DFM/DFA concepts for aerospace PCB work.

Responsibilities

  • Perform PCB layout tasks of low to medium complexity under guidance from senior designers.
  • Apply ECAD standards and workflows while completing work packages.
  • Support schematic‑to‑layout implementation including component placement and basic routing.
  • Prepare ECAD documentation such as fabrication outputs and drawings.
  • Communicate progress and seek clarification to align with design intent.
  • Collaborate with ECAD peers and support configuration management across tasks.

Skills

PCB layout
ECAD tools
Xpedition
Routing
Constraint management

Education

HS Diploma or AA/AS degree

Tools

Siemens Xpedition

Job description

Collins Aerospace is seeking a remote PCB layout specialist to contribute to ECAD tasks under senior guidance. You will apply standard ECAD workflows, place components, perform basic routing, and help generate fabrication outputs.

You will learn advanced Xpedition features, multilayer stackups, DFM concepts, and cross‑functional reviews with Electrical, Mechanical, and Manufacturing teams.

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