Reliability & Failure Analysis Engineer

Amazon Inc.; Omaha (NE); On-site; USD 117,000 - 160,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

Job summary

Amazon SPICE lab in Seattle is seeking a Failure Analysis engineer to investigate failure mechanisms in enterprise compute assemblies, including thermal management. This role requires hands-on lab work, electrical fault isolation, spectroscopy, and materials characterization to drive reliability improvements at scale.

You will liaise between SPICE lab and Annapurna Labs, coordinating failure analysis campaigns and guiding manufacturing and design best practices.

Qualifications

• Master's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent.
• Adept at electrical characterization techniques for electrical fault isolation (including curve trace, DMM) and materials characterization (SEM/EDS, FTIR, XRF, CT x-ray).
• Experience with enterprise compute thermal solutions (3D vapor chambers, immersion/liquid cooling, evaporative cooling).

Responsibilities

• Conduct failure analysis utilizing electrical fault isolation techniques, physical analysis, spectroscopy, and chemical characterization.
• Consult on corrective actions and best practices cross-functionally to improve hardware reliability.
• Interface with senior engineering staff to develop lab methods for enterprise compute assemblies including power distribution, compute, networking, and thermal management.

Skills

Electrical fault isolation

Materials characterization

Thermal management

Spectroscopy

Education

Master's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent

Tools

SEM/EDS

FTIR

XRF

CT x-ray

Job description

Amazon SPICE lab in Seattle is seeking a Failure Analysis engineer to investigate failure mechanisms in enterprise compute assemblies, including thermal management. This role requires hands-on lab work, electrical fault isolation, spectroscopy, and materials characterization to drive reliability improvements at scale.

You will liaise between SPICE lab and Annapurna Labs, coordinating failure analysis campaigns and guiding manufacturing and design best practices.