R&D Process Engineer - Diamond Packaging & Bonding

Diamond Foundry; San Francisco (CA); On-site; USD 125,000 - 145,000; Full time

Benefits offered by this job

Health insurance

Flexible spending accounts

Retirement savings plans

Employee discounts

Job summary

Diamond Foundry in San Francisco is looking for an R&D Process Engineer to support customer prototyping and internal process development for AI applications. The ideal candidate should have a strong technical background, problem-solving skills, and experience in semiconductor packaging.

This full-time position involves developing new bonding processes and managing diverse customer projects. Candidates will enjoy comprehensive benefits and competitive salary based on experience.

Qualifications

• Experience in semiconductor packaging or process engineering is preferred.
• Familiarity with surface preparation and reliability testing is desirable.

Responsibilities

• Support customer prototyping projects to integrate diamond with devices.
• Develop adaptable advanced packaging and bonding processes.
• Evaluate and optimize bonding technologies.
• Drive internal process development and validation.
• Manage end-to-end project execution.

Skills

Strong problem-solving skills

Good communication skills

Ability to work effectively with cross-functional teams

Hands-on experience

Education

Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering

Tools

Bonding technologies

Thin-film deposition

Metrology

Job description

Diamond Foundry in San Francisco is looking for an R&D Process Engineer to support customer prototyping and internal process development for AI applications. The ideal candidate should have a strong technical background, problem-solving skills, and experience in semiconductor packaging.

This full-time position involves developing new bonding processes and managing diverse customer projects. Candidates will enjoy comprehensive benefits and competitive salary based on experience.