R&D Process Engineer, Advanced Bonding Process Development

Diamondfoundry; San Francisco (CA); On-site; USD 80,000 - 100,000; Full time

Benefits offered by this job

Health insurance

Retirement savings plans

Flexible spending accounts

Paid time off

Job summary

Diamondfoundry is seeking an on-site R&D Process Engineer in San Francisco to support the AI Chips team in customer prototyping and internal process development. The ideal candidate will have a strong background in materials science and semiconductor packaging along with problem-solving skills and a motivation for learning.

The position emphasizes hands-on work in a fast-paced environment, integrating advanced diamond technology with AI devices, and driving innovative solutions.

Eligible employees enjoy benefits including health insurance, retirement plans, and flexible spending accounts.

Qualifications

• Experience in semiconductor packaging or related technical development.
• Familiarity with bonding, surface preparation, failure analysis, or similar processes.
• Willingness to learn new materials and processes.

Responsibilities

• Support customer prototyping to demonstrate thermal benefits.
• Develop packaging and bonding processes adaptable to device designs.
• Manage end-to-end project execution covering schedules and risks.

Skills

Problem-solving

Communication

Motivated

Detail-oriented

Education

Bachelor’s or advanced degree in materials science or related field

Tools

Metrology

Thin-film deposition

Bonding technologies

Job description

Overview

Diamond Foundry Inc. is a leading provider of advanced diamond wafer technology, developing solutions for AI, cloud computing, and electric vehicle power electronics. The company is on a mission to deliver diamond‑enhanced chips for maximum thermal performance.

Location

San Jose, CA (on‑site)

Job Summary

We are looking for an on‑site R&D Process Engineer to join our AI Chips team, supporting customer prototyping and internal process development for advanced packaging that integrates single‑crystal diamond with AI devices.

Responsibilities

• Support customer prototyping to integrate single‑crystal diamond with devices and demonstrate thermal and performance benefits.
• Develop advanced packaging and bonding processes adaptable to diverse device designs, material stacks, package configurations, and integration requirements.
• Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma‑activated bonding, and emerging methods.
• Drive internal process development and validation, including cleaning, metallization, DOE‑based bonding optimizations, process characterization, failure analysis, and reliability testing.
• Manage end‑to‑end project execution, covering schedules, technical risks, cross‑functional communication, customer updates, and technical reports.

Qualifications

• Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or related field.
• Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development.
• Familiarity with bonding, thin‑film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies.
• Strong problem‑solving skills and willingness to learn new materials, tools, and processes.
• Good communication skills and ability to work effectively with cross‑functional teams, hands‑on, detail‑oriented, motivated, and comfortable working in a fast‑paced development environment.

Physical Requirements

• Use appropriate PPE and follow all safety policies, practices, and procedures.
• Must sit, stand for long periods, walk, grasp, reach with hands and arms, lift below and above shoulders, bend, twist at the waist, climb, balance, stoop, squat, kneel, crawl, talk, hear, see, use fine finger manipulation, and complete repetitive motions.
• Some tasks may require the use of ladders or stairs.
• Some tasks may require driving or use of foot controls.
• Lift/carry and push/pull up to 50 pounds.

Benefits

Eligible employees can enroll in benefit programs that generally include health insurance, flexible spending accounts, retirement savings plans, life and disability insurance, and paid and unpaid time off. Medical and vision coverage are retroactive to your start date; dental and voluntary benefits take effect after enrollment.

Equal Opportunity Statement

Diamond Foundry is an Equal Opportunity Employer and considers qualified applicants for employment without regard to race, color, creed, religion, national origin, sex, sexual orientation, gender identity and expression, age, disability, veteran status, or any other protected factor under federal, state or local law.

Compliance

Diamond Foundry Inc. is committed to operating in full compliance with all applicable state and federal laws and ensuring a safe work environment.