R-10064033 Chip Lead

NXP Semiconductors; Austin (TX); Hybrid; USD 180.000 - 240.000; Vollzeit

Zusammenfassung

NXP Semiconductors in Austin, TX is seeking a Chip Lead to drive architecture decisions and lead cross-functional teams across System, IP, packaging and verification for automotive SOC projects.

You will collaborate with Marketing, PE/TE, Architecture, and post-silicon teams to ensure requirements are met, enable productization, and manage workloads within schedule constraints.

Qualifikationen

• Bachelors in Engineering with at least 15 years of design development experience and 5+ years leading design functions.
• MS in Electrical Engineering preferred; higher education may substitute for some experience.
• Experience in leading global cross-functional teams.

Aufgaben

• Lead cross-functional teams in a matrix organization across System, IP, packaging and verification.
• Define part scope, architectures and evaluate IP/packages for automotive SOCs.
• Oversee definition management and ensure implementation meets requirements.
• Collaborate with post-silicon teams to address issues and enable productization.
• Manage workload, resources and schedule to meet customer needs.

Kenntnisse

Cross-functional leadership

Global collaboration

Ausbildung

Bachelor's degree in Engineering

MS in Electrical Engineering

Jobbeschreibung

• AI & Chip Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including Automotive microprocessors, Application processors, Data Center and network processors.

Job Summary:

• Work with Systems, Marketing, PE/TE and Arch engineering to define the part. Generate and analyze data to take right and cost effective architecture decision
• Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.
• Work with IP and SoC functions (frontend, verification, AMS, DFT, Emulation, Validation, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.
• Oversee definition management and make sure the implementation complies with the requirements
• Work closely with downstream teams dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed
• Work closely with Test and Product engineering teams to enable productization.
• Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.
• Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.
• Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements
• Automotive SoC development pose additional challenges specific to implementation of safety mechanism
• Automotive SoC development requires ensuring very high quality and reliability, ensuring a very low ppm defectivity over an long product life time.
• The role includes leading the teams in a matrix organization, assimilating information from across functional teams and analyzing it in product context
• Understand impact of architecture on logical and physical realizability
• Working within resource and schedule constraints

Cross functional aspects:

• This role is primarily about leading cross functional teams
• During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors
• During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.
• Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.
• Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.

Job Qualifications:

• Bachelors in Engineering with at 15 years of design development experience, with at least 5 years of leading complete design and design functions.
• MS in Electrical Engineering preferred (higher level education may substitute for some experience).
• Experience in leading Global cross functional teams

Job location:

• The role is based in Austin/US. This is a hybrid role with a few days in the office each week and the remaining days are work from home.