Prototype RF Assembly Technician - 2nd Shift

MACOM; Morgan Hill (CA); On-site; USD 52,000 - 81,000; Full time

Benefits offered by this job

Health insurance

Employer-sponsored 401(k) plan

Paid time off

Professional development opportunities

Job summary

MACOM is seeking a self-motivated 2nd Shift Prototype Assembly Process Engineering Technician to support our prototype line developing high power RF devices.

You will program equipment, operate die bonder and wire bonders, inspect products, record data, and collaborate with engineering to improve processes. Qualified candidates have 4–8 years hands-on equipment experience and a technical degree; training starts on first shift, with 2nd shift availability.

Qualifications

• High school diploma or equivalent; associate degree in a technical field preferred.
• 4–8 years in an equipment/process technician role with hands-on experience.
• Knowledge of semiconductor assembly including die sorting, die attach, epoxy or solder dispense, wedge or ball wire bond, ultrasonic microscopy, and device sealing or over‑molding.
• Hands-on programming and operation of die attach and wire bonding equipment.
• Ability to troubleshoot, perform PMs and calibrations.
• Experience with assembly of high power RF products preferred.
• Ability to work independently with minimal supervision.
• Excellent verbal and written communication skills.
• Shift availability for 2nd shift (training may be on first or hybrid shift).

Responsibilities

• Program equipment to meet specifications per drawings and travelers.
• Run packaging assembly equipment (die bonder, wire bonders, C‑SAM, plasma cleaners, ovens, stencil, SMD chip shooter, reflow, Fico molding, lead trimming, laser marking).
• Process lots through the assembly line per travelers/drawings/work instructions.
• Perform optical inspections to ensure quality.
• Measure at critical process steps to verify specifications.
• Enter data into log files or MES for lot tracking.
• Verify product quality against requirements.
• Provide feedback to engineering on equipment/product/process issues and improvements.

Skills

Semiconductor assembly

Die attach

Wire bonding

Ultrasonic microscopy

Device sealing/Over-molding

Troubleshooting

PMs/calibrations

Independent work

Communication

RF assembly

Programming equipment

Education

High school diploma or equivalent

Associate degree in technical field

Tools

Die bonder

Wire bonder

C-SAM systems

Plasma cleaners

Ovens

Stencil

SMD chip shooter

Reflow

Fico molding

Lead trimming

Laser marking systems

Job description

MACOM is seeking a self-motivated 2nd Shift Prototype Assembly Process Engineering Technician to support our prototype line developing high power RF devices.

You will program equipment, operate die bonder and wire bonders, inspect products, record data, and collaborate with engineering to improve processes. Qualified candidates have 4–8 years hands-on equipment experience and a technical degree; training starts on first shift, with 2nd shift availability.