Product Manager: Advanced Polymer Packaging Growth

Qnity Electronics, Inc.

Marlborough (MA)

On-site

USD 110,000 - 150,000

Full time

14 days+
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Job summary

Qnity Electronics, Inc. is seeking a Product Manager – Advanced Packaging Polymer to guide the growth, profitability, and strategy of our polymer portfolio for next-gen semiconductor packaging. You will work with R&D, manufacturing, supply chain, and sales to drive strategy, pricing, and cross-functional execution.

This role emphasizes market insight, program leadership, and collaboration with foundries, OSATs, and industry partners to meet future packaging requirements and growth opportunities.

Qualifications

  • Bachelor's degree in a technical field related to polymers, materials or semiconductors.
  • 2+ years in semiconductor, advanced packaging, electronics or specialty materials.
  • 2+ years in product management, marketing, or commercial roles.
  • Experience managing product portfolios, pricing, forecasting, and performance.

Responsibilities

  • Own product portfolio performance including revenue and profitability.
  • Develop pricing strategies, forecasts, and product roadmaps.
  • Lead product launches, portfolio optimization, and rationalization.
  • Drive commercialization and support customer qualifications for new products.

Skills

Product management
Cross-functional leadership
Pricing
Forecasting
P&L
Financial acumen
Communication
Presentation
Semiconductor packaging
Polymer science

Education

Bachelor's degree in Chemical Engineering, Materials Science, Polymer Science, Chemistry, Semiconductor Engineering
Master's degree (preferred)

Job description

Qnity Electronics, Inc. is seeking a Product Manager – Advanced Packaging Polymer to guide the growth, profitability, and strategy of our polymer portfolio for next-gen semiconductor packaging. You will work with R&D, manufacturing, supply chain, and sales to drive strategy, pricing, and cross-functional execution.

This role emphasizes market insight, program leadership, and collaboration with foundries, OSATs, and industry partners to meet future packaging requirements and growth opportunities.

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