Process & Quality Engineer – Die Attach/Wire Bond

WENCOR; Sunnyvale (CA); On-site; USD 100,000 - 140,000; Full time

Job summary

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), is seeking a hands-on Process & Quality Engineer to strengthen and continuously improve our semiconductor assembly processes, focusing on die attach and wire bonding.

Our small, experienced team collaborates across engineering, operations, and quality to sustain legacy devices and comply with ISO 9001 and AS9100 requirements, balancing process and quality work with production priorities.

Qualifications

• Hands-on Process & Quality Engineer focused on die attach and wire bonding in semiconductor assembly.
• Convert practical shop-floor knowledge into stable, repeatable processes.
• Contribute to ISO 9001/AS9100 quality-management activities.

Responsibilities

• Own and improve die attach, wire bonding, and related microelectronic assembly processes.
• Develop, document, and maintain process parameters, work instructions, travelers, and training materials.
• Design fixtures and tooling to improve manufacturability, quality, and operator safety.
• Troubleshoot equipment and process issues and implement corrective actions.
• Support ISO 9001/AS9100 quality-management activities and audits.
• Lead or assist root-cause investigations and corrective actions.
• Assist with risk assessments, process controls, and change control documentation.
• Coordinate supplier quality issues and calibration/document control tasks.

Job description

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), is seeking a hands-on Process & Quality Engineer to strengthen and continuously improve our semiconductor assembly processes, focusing on die attach and wire bonding.

Our small, experienced team collaborates across engineering, operations, and quality to sustain legacy devices and comply with ISO 9001 and AS9100 requirements, balancing process and quality work with production priorities.