Process Integration and Yield Technician (ICE)

intel

Hillsboro (OR)

On-site

USD 52,000 - 200,000

Full time

5 days ago
Be an early applicant
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Benefits offered by this job

Stock bonuses
Health benefits
Vacation

Job summary

Intel in Hillsboro, Oregon, seeks two ORAP Integration Yield Technicians to sustain and develop processes across HBI, WLA, Die Prep and TSVr on-site. The role involves real-time troubleshooting, material disposition, defect investigation, and collaboration with integration engineers and factory teams.

Candidates should have STEM degrees with 2+ years (or equivalent) related experience, strong problem-solving skills, and ability to work in a cleanroom environment with strict safety procedures.

Qualifications

  • Bachelor's Degree in a science, technology, math, engineering, or related STEM discipline AND 2 years directly related experience.
  • OR Associates degree in a science, technology, math, engineering, or related STEM discipline AND 6 years directly related experience.
  • OR HS/GED or higher non-semi degree/technical cert AND 6+ years related hands on experience including military technical experience
  • HS/GED or higher non-semi degree/technical cert AND 4+ years Field Service Engineer related semiconductor experience

Responsibilities

  • Manage material disposition and lot movement. Review held lots, investigate barriers to processing, and execute authorized lot releases, splits, merges, scraps, and conversions in accordance with established procedures.
  • Maintain accurate manufacturing instructions and flows. Update lot plans, routes, operations, attributes, special instructions, and slot maps to support manufacturing and engineering requirements.
  • Troubleshoot manufacturing systems and automation issues. Resolve or elevate quantity mismatches, transfer issues, slot discrepancies, carrier identification problems, shipping errors, and other issues affecting material movement.
  • Respond to factory escalations and process excursions. Serve as an initial point of contact for integration issues, participate in assigned on-call coverage, contain material outside approved process conditions, and elevate risks appropriately.
  • Support defect investigation and failure analysis. Perform visual and microscope inspections, execute defect inking and disposition activities, collect inspection data, and coordinate material collection and shipment for failure analysis.
  • Collect and communicate technical data. Use manufacturing systems, SQL, iTech, and Microsoft applications to extract lot information, perform basic analyses, and document findings supporting engineering decisions.
  • Coordinate daily factory support. Participate in integration huddles, held-lot reviews, and operational follow-up; communicate material status, outstanding actions, and unresolved issues across teams.
  • Strengthen process quality and team capability. Help refine best-known methods and standard procedures, support engineering experiments, share knowledge with peers, and demonstrate safe, quality-focused behavior, including Stop the Job when appropriate.

Skills

SQL
Bi4 Reports
Data analysis
Process knowledge
Attention to detail
Cross-functional collaboration

Education

Bachelor's Degree in STEM
Associates Degree in STEM
HS/GED with technical cert

Job description

Job Details
Job Description

Intel's Wafer Packaging Manufacturing organization supports semiconductor wafer processing, testing, and die-to-wafer assembly. We are seeking two ORAP (Oregon Advanced Packaging) Integration Yield Technicians to provide manufacturing sustaining and engineering development support across HBI, WLA, Die Prep, and TSVr. You will work closely with integration engineers, factory operations, and cross-functional teams to resolve material issues, contain process excursions, and keep work in process moving safely through the factory.

This hands-on role combines real-time troubleshooting, lot disposition, defect investigation, and continuous improvement. HBI ramp support is a major focus, alongside sustaining support for other packaging operations.

This position requires regular onsite presence and work in a cleanroom environment using required protective clothing and equipment, including coveralls, hoods, booties, safety glasses, and gloves. The role includes extended periods of standing or sitting while performing technical duties.

Shift and coverage: Work a shift 8 compressed work week schedule on the front half of the week or back half of the week. The schedule will consist of three twelve-hour day/nights in a row followed by a four-day/night week every other week (Sunday-Tuesday every other Wednesday 12:00 p.m-12:30 a.m.) or (Thursday-Saturday every other Wednesday 12:00p.m-12:30am).

Work in a clean room environment wearing coveralls hoods booties safety glasses and gloves as needed. Spend the majority of time (more than 90 percent less break time) standing/sitting for 9 hours. Be able to lift 11-25lbs.

Key responsibilities

  • Manage material disposition and lot movement. Review held lots, investigate barriers to processing, and execute authorized lot releases, splits, merges, scraps, and conversions in accordance with established procedures.
  • Maintain accurate manufacturing instructions and flows. Update lot plans, routes, operations, attributes, special instructions, and slot maps to support manufacturing and engineering requirements.
  • Troubleshoot manufacturing systems and automation issues. Resolve or elevate quantity mismatches, transfer issues, slot discrepancies, carrier identification problems, shipping errors, and other issues affecting material movement.
  • Respond to factory escalations and process excursions. Serve as an initial point of contact for integration issues, participate in assigned on-call coverage, contain material outside approved process conditions, and elevate risks appropriately.
  • Support defect investigation and failure analysis. Perform visual and microscope inspections, execute defect inking and disposition activities, collect inspection data, and coordinate material collection and shipment for failure analysis.
  • Collect and communicate technical data. Use manufacturing systems, SQL, iTech, and Microsoft applications to extract lot information, perform basic analyses, and document findings supporting engineering decisions.
  • Coordinate daily factory support. Participate in integration huddles, held-lot reviews, and operational follow-up; communicate material status, outstanding actions, and unresolved issues across teams.
  • Strengthen process quality and team capability. Help refine best-known methods and standard procedures, support engineering experiments, share knowledge with peers, and demonstrate safe, quality-focused behavior, including Stop the Job when appropriate.

Behavioral skills:

  • Commitment with quality.
  • Critical thinking
  • Ability to deal with ambiguous situations
  • Prioritization skills in a highly dynamic environment
  • Ability to work well across multiple teams
  • Excellent written, and verbal communication skills
  • Ability to provide technical direction
  • Excellent listening skills
  • High attention to detail
  • Ability to influence
  • Self-starter and continuous learner
Qualifications

You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. This position is not eligible for Intel immigration sponsorship.

2-year contract - with potential to convert to a permanent role based on performance and business needs.

Minimum Qualifications

  • Bachelor's Degree in a science, technology, math, engineering, or related STEM discipline AND 2 years directly related experience
  • OR Associates degree in a science, technology, math, engineering, or related STEM discipline AND 6 years directly related experience.
  • OR HS/GED or higher non-semi degree/technical cert AND 6+ years related hands on experience including military technical experience
  • HS/GED or higher non-semi degree/technical cert AND 4+ years Field Service Engineer related semiconductor experience

Directly related experience may include but not limited to: Metrology, Defect metrology, Failure Analysis, Fault Isolation, Defect/process and electrical characterization, Chemical Composition Analysis, Electronics, Mechanics, Chemistry, Materials Science or a similar technical discipline.

Preferred Qualifications

  • Coding experience - SQL, Bi4 Reports
  • Data analysis experience - JMP, GAJT
  • Ability to influence, collaborate and effectively communicate
  • Self-starter and continuous learner.
  • HBI, Die Prep, WLA, TSVr process knowledge
  • Works well in ambiguous and highly dynamic environment
  • High attention to detail
Job Type

Intel Contract Employee

Shift

Shift 8 (United States of America)

Primary Location

US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $52,000.00-$200,000.00 (Hourly Role) The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

* Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Process Integration and Yield Technician (ICE)
Process Integration and Yield Technician (ICE)

Intel Corporation • Hillsboro (OR)

On-site
USD 52,000 - 200,000
Process Integration and Yield Technician
Process Integration and Yield Technician

intel • Hillsboro (OR)

On-site
USD 52,000 - 100,000
Health insurance
Stock bonuses
Vacation
Intel Foundry Process Integration and Yield Technician - Metrology
Intel Foundry Process Integration and Yield Technician - Metrology

Intel Corporation • Hillsboro (OR)

On-site
USD 60,000 - 85,000
Stock bonuses
Health benefits
Retirement plan
+1
Intel Foundry Process Integration and Yield Technician - Metrology
Intel Foundry Process Integration and Yield Technician - Metrology

Intel • Hillsboro (OR)

On-site
USD 60,000 - 85,000
Stock bonuses
Health benefits
Vacation plan
Ocotillo Technology Fabrication Yield Integration Technician
Ocotillo Technology Fabrication Yield Integration Technician

Intel • Phoenix (AZ)

On-site
USD 60,000 - 117,000
Stock bonuses
Health benefits
Retirement plan
+1
Advanced Packaging Module Development Engineer
Advanced Packaging Module Development Engineer

intel • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Health benefits
Stock bonuses
Retirement plan
+1
Advanced Packaging Module Development Engineer
Advanced Packaging Module Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Health benefits
Stock bonuses
Retirement plan
+1
Process Integration Development Engineer
Process Integration Development Engineer

Intel • Hillsboro (OR)

On-site
USD 156,000 - 220,000
Stock bonuses
Health plan
Mask Manufacturing Technician
Mask Manufacturing Technician

Intel • Hillsboro (OR)

On-site
USD 52,000 - 73,000
Stock bonuses
Health benefits
Vacation and retirement plans
AMHS Equipment Technician
AMHS Equipment Technician

Intel • Hillsboro (OR)

On-site
USD 60,000 - 100,000
Competitive pay
Stock bonuses
Benefits package