Process Integration and Yield Technician (ICE)

Intel Corporation; Hillsboro (OR); On-site; USD 52,000 - 200,000; Full time

Job summary

Intel Corporation in Hillsboro, Oregon is seeking two ORAP (Oregon Advanced Packaging) Integration Yield Technicians to support manufacturing and engineering development across HBI, WLA, Die Prep, and TSVr. This onsite role involves troubleshooting, lot disposition, defect analysis, and continuous improvement in a cleanroom environment.

You will collaborate with engineers and operations, handle material movements, and participate in on-call coverage while maintaining safety and quality standards

Qualifications

• Bachelor's Degree in science, technology, math, engineering, or related STEM field and 2 years related experience OR
• Associates degree in science/engineering with 6 years related experience OR
• HS/GED with a technical cert and 6+ years hands-on semiconductor experience.

Responsibilities

• Manage material disposition and lot movement; review held lots and investigate barriers to processing.
• Execute authorized lot releases, splits, merges, scraps, and conversions per procedures.
• Maintain manufacturing instructions, update lot plans, routes, and slot maps to support requirements.
• Troubleshoot manufacturing systems and automation issues; resolve quantity mismatches and transfer issues.
• Support defect investigation, failure analysis, and collect data for engineering decisions.

Skills

Critical thinking

Prioritization

Excellent written and verbal comms

Self-starter

Continuous learner

Influencing

Attention to detail

Cross-functional collaboration

Education

Bachelor's Degree in STEM

Associates degree in STEM

HS/GED with tech cert

Tools

SQL

iTech

Microsoft applications

Job description

Job Details: Job Description:

Intel’s Wafer Packaging Manufacturing organization supports semiconductor wafer processing, testing, and die-to-wafer assembly. We are seeking two ORAP (Oregon Advanced Packaging) Integration Yield Technicians to provide manufacturing sustaining and engineering development support across HBI, WLA, Die Prep, and TSVr. You will work closely with integration engineers, factory operations, and cross-functional teams to resolve material issues, contain process excursions, and keep work in process moving safely through the factory. This hands-on role combines real-time troubleshooting, lot disposition, defect investigation, and continuous improvement. HBI ramp support is a major focus, alongside sustaining support for other packaging operations. This position requires regular onsite presence and work in a cleanroom environment using required protective clothing and equipment, including coveralls, hoods, booties, safety glasses, and gloves. The role includes extended periods of standing or sitting while performing technical duties. Shift and coverage: Work a shift 8 compressed work week schedule on the front half of the week or back half of the week. The schedule will consist of three twelve-hour day/nights in a row followed by a four-day/night week every other week (Sunday-Tuesday every other Wednesday 12:00 p.m-12:30 a.m.) or (Thursday-Saturday every other Wednesday 12:00p.m-12:30am). Work in a clean room environment wearing coveralls hoods booties safety glasses and gloves as needed. Spend the majority of time (more than 90 percent less break time) standing/sitting for 9 hours. Be able to lift 11-25lbs.

Key responsibilities

Manage material disposition and lot movement. Review held lots, investigate barriers to processing, and execute authorized lot releases, splits, merges, scraps, and conversions in accordance with established procedures. Maintain accurate manufacturing instructions and flows. Update lot plans, routes, operations, attributes, special instructions, and slot maps to support manufacturing and engineering requirements. Troubleshoot manufacturing systems and automation issues. Resolve or escalation quantity mismatches, transfer issues, slot discrepancies, carrier identification problems, shipping errors, and other issues affecting material movement. Respond to factory escalations and process excursions. Serve as an initial point of contact for integration issues, participate in assigned on-call coverage, contain material outside approved process conditions, and elevate risks appropriately. Support defect investigation and failure analysis. Perform visual and microscope inspections, execute defect inking and disposition activities, collect inspection data, and coordinate material collection and shipment for failure analysis. Collect and communicate technical data. Use manufacturing systems, SQL, iTech, and Microsoft applications to extract lot information, perform basic analyses, and document findings supporting engineering decisions. Coordinate daily factory support. Participate in integration huddles, held-lot reviews, and operational follow-up; communicate material status, outstanding actions, and unresolved issues across teams. Strengthen process quality and team capability. Help refine best-known methods and standard procedures, support engineering experiments, share knowledge with peers, and demonstrate safe, quality-focused behavior, including Stop the Job when appropriate. Behavioral skills: Commitment with quality. Critical thinking Ability to deal with ambiguous situations Prioritization skills in a highly dynamic environment Ability to work well across multiple teams Excellent written, and verbal communication skills Ability to provide technical direction Excellent listening skills High attention to detail Ability to influence Self-starter and continuous learner.

Qualifications

You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. This position is not eligible for Intel immigration sponsorship. 2-year contract - with potential to convert to a permanent role based on performance and business needs. Minimum Qualifications Bachelor's Degree in a science, technology, math, engineering, or related STEM discipline AND 2 years directly related experience OR Associates degree in a science, technology, math, engineering, or related STEM discipline AND 6 years directly related experience. OR HS/GED or higher non-semi degree/technical cert AND 6+ years related hands on experience including military technical experience HS/GED or higher non-semi degree/technical cert AND 4+ years Field Service Engineer related semiconductor experience Directly related experience may include but not limited to: Metrology, Defect metrology, Failure Analysis, Fault Isolation, Defect/process and electrical characterization, Chemical Composition Analysis, Electronics, Mechanics, Chemistry, Materials Science or a similar technical discipline. Preferred Qualifications Coding experience - SQL, Bi4 Reports Data analysis experience - JMP, GAJT Ability to influence, collaborate and effectively communicate Self-starter and continuous learner. HBI, Die Prep, WLA, TSVr process knowledge Works well in ambiguous and highly dynamic environment High attention to detail.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $52,000.00-$200,000.00 (Hourly Role) The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation or ordinance. Position of Trust N/A.

Job Type: Intel Contract Employee Shift: Shift 8 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations:

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change. ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.