Process Improvement Engineer(A Group MLB._.RE)-Houston,TX

鴻海精密工業股份有限公司; Houston (TX); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Modern, collaborative offices

Continuous learning and career growth opportunities

Job summary

A global electronics manufacturing leader seeks a Process Improvement Engineer in Houston, Texas. The role involves managing BGA rework equipment, ensuring operational reliability and product quality through process optimization, and standardizing procedures to eliminate defects. The ideal candidate will hold a bachelor’s degree in Electrical Automation Engineering, with 3-8 years of relevant experience. Knowledge of SMT IPC standards is a plus, and the position offers a collaborative working environment that emphasizes continuous learning and career growth.

Qualifications

• Successful completion of high school plus a bachelor’s and master’s degree required.
• 3 to 8 years of experience in Automation, Mechanical Engineering, or Electronics sectors.
• Familiarity with SMT IPC standards and PCB manufacturing processes.

Responsibilities

• Dynamically adjust BGA rework equipment parameters based on product requirements.
• Perform BGA device cleaning, inspections, and preventive maintenance.
• Design standardized workflows for diverse components.
• Analyze Control-Run project yield data and implement improvement plans.
• Aggregate monthly PDCA results and communicate progress to clients.
• Adhere to company policies in all operational workflows.

Skills

Proficient in English

End-to-end electronics manufacturing expertise

Proficiency in SMT IPC standards

Education

Bachelor’s degree in Electrical Automation Engineering

Master’s degree

Tools

SMT assembly tooling

Wave soldering equipment

PCB manufacturing equipment

Job description

Purpose of the position

Foxconn Technology Group, a global electronics manufacturing leader, seeks a Process Improvement Engineer to drive operational reliability and product quality by leading BGA rework equipment programming, maintenance protocols, and Control‑run‑managed process optimization. Responsibilities include standard operating procedure standardization, yield‑driven problem resolution, client inquiry management, FACA analysis reporting, and PDCA‑driven improvements to eliminate defects and boost repair efficiency.

Duties and Responsibilities

1. Dynamically adjust BGA rework equipment parameters based on product requirements to ensure precision, and validate equipment stability in real‑time.
2. Perform BGA device cleaning, component inspections, and preventive maintenance, document anomalies, and drive rapid fixes to avoid downtime.
3. Design standardized workflows for diverse components and validate feasibility through hands‑on testing.
4. Analyze Control‑Run project yield data and bottlenecks, implement improvement plans, and align outputs with customer specifications.
5. Aggregate monthly PDCA results (e.g., efficiency gains, cost optimizations), analyze gaps, plan next steps, and communicate progress to clients to address technical queries, ensure compliance, and strengthen trust.
6. Adhere to company policies and Standard Operating Procedures in all operational workflows.

Education and work experience

1. Successful completion of 4‑years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electrical Automation Engineering.
2. 3 to 8 years of experience in Automation, Mechanical Engineering, or Electronics sectors.

Working conditions

• Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
• Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

Skills

1. Proficient in English is required; working knowledge of Mandarin is preferred but not required. Proficiency in Spanish is a plus.
2. End‑to‑end electronics manufacturing expertise with hands‑on SMT assembly and wave soldering optimization to resolve production bottlenecks and drive process efficiency.
3. Proficiency in SMT IPC standards and PCB manufacturing processes to design quality‑driven solutions, ensure compliance, and optimize production workflows.