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Foxconn Technology Group, a globally leading electronics manufacturing company, is now hiring a SMT Process Experiment Engineer. Lead failure mode experiment analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as Cross-section/Dye & pry / Thrust & Pull/ Torsion etc. Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using optical microscopy, data support for process optimization and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs).
Educational Requirements: Bachelor's degree or above. The best major in electronics, mechanical engineering, chemistry and physics.
Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply.