Process Engineer - Semiconductor Packaging & Testing

Kulicke & Soffa; Fort Washington (Montgomery County); On-site; USD 85,000 - 120,000; Full time

Job summary

Kulicke & Soffa in the United States seeks an engineer to support the development of Semiconductor Packaging and Assembly equipment. You will perform detailed design, analysis and integration of electro-mechanical and software subsystems, and you will operate wire bonders and test equipment to advance product readiness.

Responsibilities include testing ultrasonic transducers and sensors, running experiments (DOE), collecting data, and writing engineering reports and presentations.

Qualifications

• BS in Mechanical or Mechatronics Engineering; MS preferred.
• General Wire Bonding and Wedge Bonding processes experience.
• Strong background in engineering, material science and statistical control.
• Good communication skills, willingness to learn and hands-on capability.

Responsibilities

• Detailed design, analysis, development and organization of electro-mechanical and software systems.
• Design, analyze and testing of Ultrasonic Transducers and Sensors, including Bode, Vibrometer, FE modeling.
• Perform DOE, analysis of variants, and statistical methods to solve problems.
• Operate wire bonders and other test/measurement equipment; supervise others as needed.
• Run tests on bench or on the wire bonder; collect data and write reports.

Skills

Wire bonding experience

Analytical thinking

Design of Experiments

Statistical analysis

Communication

Education

BS in Mechanical or Mechatronics Engineering

MS degree preferred

Tools

Oscilloscope

Bench testing equipment

FE modeling

Job description

Kulicke & Soffa in the United States seeks an engineer to support the development of Semiconductor Packaging and Assembly equipment. You will perform detailed design, analysis and integration of electro-mechanical and software subsystems, and you will operate wire bonders and test equipment to advance product readiness.

Responsibilities include testing ultrasonic transducers and sensors, running experiments (DOE), collecting data, and writing engineering reports and presentations.