Process Engineer

Kulicke & Soffa; Fort Washington (Montgomery County); On-site; USD 85,000 - 120,000; Full time

Job summary

Kulicke & Soffa in the United States seeks an engineer to support the development of Semiconductor Packaging and Assembly equipment. You will perform detailed design, analysis and integration of electro-mechanical and software subsystems, and you will operate wire bonders and test equipment to advance product readiness.

Responsibilities include testing ultrasonic transducers and sensors, running experiments (DOE), collecting data, and writing engineering reports and presentations.

Qualifications

• BS in Mechanical or Mechatronics Engineering; MS preferred.
• General Wire Bonding and Wedge Bonding processes experience.
• Strong background in engineering, material science and statistical control.
• Good communication skills, willingness to learn and hands-on capability.

Responsibilities

• Detailed design, analysis, development and organization of electro-mechanical and software systems.
• Design, analyze and testing of Ultrasonic Transducers and Sensors, including Bode, Vibrometer, FE modeling.
• Perform DOE, analysis of variants, and statistical methods to solve problems.
• Operate wire bonders and other test/measurement equipment; supervise others as needed.
• Run tests on bench or on the wire bonder; collect data and write reports.

Skills

Wire bonding experience

Analytical thinking

Design of Experiments

Statistical analysis

Communication

Education

BS in Mechanical or Mechatronics Engineering

MS degree preferred

Tools

Oscilloscope

Bench testing equipment

FE modeling

Job description

At Kulicke and Soffa, (NASDAQ:KLIC) our engineers make that decision daily. We are an international leading provider of robotic semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. We are seeking an engineer who with their related experience will provide solutions support of the development of Semiconductor Packaging and Assembly equipment. Specific duties will include:

• Detailed design, analysis, development and organization of electro-mechanical and / or software systems, consisting of specialized sub-systems and their integration into products and applications.
• Design, analyze and testing of Ultrasonic Transducers and Sensors, including Bode, Vibrometer, FE modeling and simulations
• Problem solve on a wide range of difficult problems within an engineering discipline in imaginative and practical ways, utilizes experimental methods such as design of experiments (DOE), analysis of variants, linear regression analysis, statistical process and control.
• Analysis of situation or data requiring detailed evaluation of identifiable factors, exercises judgment within broadly defined practices and policies in selecting methods, techniques and evaluation criteria for obtaining results.
• Assist in preparation of engineering plans and programs.
• Independent operating of wire bonders and other test and measurement equipment. Receive minimal instruction on new assignments and provide technical guidance and leads or coordinates the activities of other engineers, designers and technicians.
• Running tests on bench or on the wire bonder.
• Collect and analyze data and write engineering report and presentations.
• Tests could involve using oscilloscope and other instruments as needed.

Qualifications

Requirements:

• BS in Mechanical or Mechatronics Engineering, MS degree is preferred.
• General related Wire Bonding and Wedge Bonding process experience.
• Position requires good knowledge and background in engineering, material science and statistical control.
• Good communication skills, willingness to learn and good hands-on capability.