Process Engineer, Semiconductor Packaging & Cleanroom

Micross Logo

Durham (NC)

On-site

USD 90,000 - 120,000

Full time

14 days+
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Benefits offered by this job

Medical benefits
HSA/FSA
Dental plan
Vision plan
Life insurance
401k match
Paid leave
Vacation
Holidays
Tuition assistance
Pet insurance
Legal insurance

Job summary

Micross in Durham, NC seeks a hands-on packaging/materials professional for wafer processing in a cleanroom. You will troubleshoot, optimize process flows, and report findings in a collaborative, data-driven team environment.

Required 5+ years in advanced packaging with wafer process knowledge and strong analytical skills. Strong communication and ability to generate reports are essential; US citizenship or permanent residency is required.

Qualifications

  • Associates or better in Engineering or related field.
  • Preferred: Bachelors or better in Engineering or related field.
  • 5+ years of hands-on experience in advanced packaging and materials processing
  • Experience with wafer processing and cleanroom understanding is expected.
  • Metrology, data recording and data presentation (PowerPoint) is a plus.

Responsibilities

  • Communicate results and concerns in a collaborative, data-driven environment.
  • Participate in process improvement experiments; record and report data accurately.
  • Adhere to safety, quality and ITAR policies; maintain cleanroom discipline.
  • Build relationships with internal partners and contribute to departmental goals.
  • Perform other duties as assigned.

Skills

Hands-on lab skills
Written & verbal communication
Data collection & analysis
Microsoft Office
Report generation
Analytical skills

Education

Associate degree or higher in engineering/physical science
Bachelor's degree or higher in engineering/related field

Job description

Micross in Durham, NC seeks a hands-on packaging/materials professional for wafer processing in a cleanroom. You will troubleshoot, optimize process flows, and report findings in a collaborative, data-driven team environment.

Required 5+ years in advanced packaging with wafer process knowledge and strong analytical skills. Strong communication and ability to generate reports are essential; US citizenship or permanent residency is required.

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