Process Engineer – Semiconductor Packaging

Crosslinked; Sunnyvale (CA); On-site; USD 130,000 - 175,000; Full time

Benefits offered by this job

Medical Insurance

Dental Insurance

Vision Insurance

Paid Time Off

401k with employer match

Flexible Spending Accounts

Employee Assistance Program

Life/AD&D Insurance

Job summary

LUMINUS seeks a Process Engineer with semiconductor packaging experience to lead both process development and NPI for high power LED products in Sunnyvale, CA. The role splits roughly 50/50 between process engineering and leading new product introductions.

The candidate should have a Master or PhD in engineering/related fields and 5+ years of manufacturing experience in semiconductor packaging, including wire bonding and die attach.

Qualifications

• Master or PhD degree in engineering, physics, materials or related fields.
• Minimum 5 years of experience in manufacturing processing of semiconductor packages, including wire bonding, die attach (epoxy, eutectic, sintering) and dispensing.
• Be familiar with standard packaging technologies used in power devices, such as lead frame, ceramic (single & multi-layer) and ceramic packages with integrated copper heat spreaders.
• Have experience with hermetic sealing, over molding and transfer/injection molding processes.
• Practice with critical processes such as D/PFMEA for power semiconductor products.
• Experience working with CM’s is desirable.
• Highly motivated individual and good team player. “Whatever it takes” attitude - Strong sense of project ownership with strong desire to push projects toward end goals.
• Be able to travel internationally on a need basis. (up to 20%)

Responsibilities

• Develop recipes for wire bonding, die attach and dispensing processes for a low volume prototype assembly line.
• Build Control Plan for these processes and track via destructive test monitoring and SPC.
• Publish lot reports, including pareto of yield losses, CpK, etc.
• Transfer recipes, control plan, etc. to high volume manufacturing partners in the Asia region.
• Evaluate new materials for these processes to improve performance or reduce costs.
• Develop high power LED packages for Medical, Life Sciences and Industrial applications.
• Collaborate with Asian Contract Manufacturers to co-develop LED packages from initial concepts through mass production to optimize performance and cost.
• Engage with the Supply Chain for critical BOM items, e.g. prisms, interposers, etc.
• Manage projects and track progress. Update the larger Project team on a weekly basis.
• Generating intellectual property and working with patent attorneys to file patent applications.

Skills

Process engineering

Wire bonding

Die attach

Dispensing

D/PFMEA

Travel

Project management

Education

Master or PhD in engineering/physics/materials

Job description

Crosslinked

Jobs/Electronic materials/Process Engineer – Semiconductor Packaging

LU

Process Engineer – Semiconductor Packaging

LUMINUS

• Sunnyvale, CA

$130k – $175k via direct_data

Senior

Work On-site

Type Full-time

Degree MS

Experience 5+ yrs

Industry Electronics

Role Process Engineering

Materials epoxyeutecticsintering materialsceramicscopper

Techniques SPCDestructive testingD/PFMEA

Luminus is a vertically integrated fast-growing high-tech company that engages in high power Light-Emitting-Diode (LED) solid-state lighting for a variety of application areas such as industrial UV, IR, medicals, projection displays, high-end illumination lighting, horticulture lighting, and automotive lighting. Luminus is at the forefront of the undergoing solid-state lighting revolution that will change lighting technology in almost every aspect of our everyday work and life. Luminus, Inc.

is an Equal Opportunity Employer. We foster a work environment that's inclusive as well as diverse and if you are looking for a place where you can grow, work hard, and have fun this is a GREAT opportunity to learn about the lighting technology world and be part of an exciting forward company!

We are looking for a Process Engineer with experience in Semiconductor Packaging, especially in high power applications. The successful candidate will spend approximately 50% performing Process Engineering and 50% of their time leading New Product Introduction (NPI) for high power LED products. This is an excellent opportunity for an experienced Process Engineer to diversify his career with Product Development – Project Management Experience.

Key Responsibilities

50%

• Develop recipes for wire bonding, die attach and dispensing processes for a low volume prototype assembly line.
• Build Control Plan for these processes and track via destructive test monitoring and SPC.
• Publish lot reports, including pareto of yield losses, CpK, etc.
• Transfer recipes, control plan, etc. to high volume manufacturing partners in the Asia region.
• Evaluate new materials for these processes to improve performance or reduce costs.

50%

• Develop high power LED packages for Medical, Life Sciences and Industrial applications. This requires innovative thinking on concepts, conducting optical performance testing and hands on experimentation to validate design.
• Collaborate with Asian Contract Manufacturers to co-develop LED packages from initial concepts through mass production to optimize performance and cost.
• Engage with the Supply Chain for critical Bill of Material items, e.g. prisms, interposers, etc.
• Manage projects and track progress. Update the larger Project team on a weekly basis.
• Generating intellectual property and working with patent attorneys to file patent applications.

Qualifications For The Position

• Master or PhD degree in engineering, physics, materials or related fields.
• Minimum 5 years of experience in manufacturing processing of semiconductor packages, including wire bonding, die attach (epoxy, eutectic, sintering) and dispensing. Experience with high power packages is preferred. Specific experience with LED Diode packages is highly desirable.
• Be familiar with the standard packaging technologies used in power devices, such as lead frame, ceramic (single & multi-layer) and ceramic packages with integrated copper heat spreaders.
• Have experience with hermetic sealing, over molding and transfer/injection molding processes.
• Practice with critical processes such as D/PFMEA for power semiconductor products.
• Experience working with CM’s is desirable.
• Highly motivated individual and good team player. “Whatever it takes” attitude - Strong sense of project ownership with strong desire to push projects toward end goals.
• Be able to travel internationally on a need basis. (up to 20%)

Benefits & Perks

• Medical/Dental/Vision Insurance
• Paid Time Off & Holidays
• 401k Retirement Savings Plan w/ Employer Match
• Flexible Spending Accounts
• Employee Assistance Program
• Life/AD&D Insurance
• And more!

Compensation Range: $130,000 - $175,000 / year

Title and compensation will be commensurate with experience and qualification.

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