Process Engineer: PCB Yield & Process Improvement Lead

El Camino Health; Logan (UT); On-site; USD 65,000 - 95,000; Full time

Job summary

TTM Technologies, Inc. is a leading global PCB manufacturer seeking a process-focused engineer to design and optimize plating and surface finish processes. The role emphasizes copper plating (electrochemical and electroless) and ENEPIG exposure across PCB fabrication lines.

Responsibilities include leading teams, improving process yields, and collaborating with customers to address failures, while ensuring procedures are followed and equipment is specified for robust production.

Qualifications

• Bachelor's degree in a technically related field.
• 1-5 years electrochemical copper plating experience.
• 1-5 years electroless copper plating experience.
• 1-5 years ENEPIG surface finish experience.
• 1-3 year(s) general PCB experience.
• #COMBU #LI-EC1

Responsibilities

• Read, understand and follow written procedures in English and company specs.
• Lead and direct the work of others; focus on process yield and improvement.
• Interact with customers regarding process improvement and failure analysis.
• Support manufacturing by process definition and implementation.
• Specify materials, tools, equipment and process parameters; assist in training.

Skills

electrochemical copper plating

electroless copper plating

ENEPIG surface finish

PCB fabrication experience

leadership

Education

Bachelor's degree in a technically related field

Job description

TTM Technologies, Inc. is a leading global PCB manufacturer seeking a process-focused engineer to design and optimize plating and surface finish processes. The role emphasizes copper plating (electrochemical and electroless) and ENEPIG exposure across PCB fabrication lines.

Responsibilities include leading teams, improving process yields, and collaborating with customers to address failures, while ensuring procedures are followed and equipment is specified for robust production.