Process Engineer — III-V Semiconductor / Laser Wafer Fab

Glint Tech Solutions; SOUTH PLAINFIELD (NJ); On-site; USD 90,000 - 130,000; Full time

Job summary

Glint Tech Solutions in New Jersey is seeking a Process Engineer to support and develop advanced III-V semiconductor laser wafer fabrication processes, focusing on InP BH laser fabrication, including photolithography, etching, film deposition, wafer cleaning, metrology, and process control.

The role involves troubleshooting, DOE and new process development with device design engineers, developing metrology methods, analyzing process data, and training production technicians.

Qualifications

• MS or PhD in a relevant engineering or science discipline is required.
• 1–3 years of semiconductor fab experience preferred.
• Hands-on experience with photolithography, dry/wet etching, and wafer cleaning.
• Experience in process development, troubleshooting, and process control.
• Familiarity with SEM/EDS/ellipsometry/profilometry for characterization.
• Experience with III-V/InP photonics or laser fabrication is highly preferred.

Responsibilities

• Support InP BH laser wafer fabrication processes including lithography and etching.
• Work with photolithography, holographic grating, deposition, etching, and cleaning.
• Monitor processes using SPC and other control methods.
• Troubleshoot fabrication issues and drive yield improvements.
• Collaborate with design engineers on DOE and new process development.
• Develop metrology methods and analyze process data for reports.
• Support equipment maintenance and liaise with suppliers.
• Create work instructions and train production technicians.

Skills

Photolithography

Wafer cleaning

Etching (dry/wet)

Process control

DOE/Process development

Metrology

Education

MS or Ph.D. in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or related discipline

Tools

SEM

EDS

Ellipsometer

Profilometer

Job description

Position Overview

We are seeking a Process Engineer to support and develop advanced III-V semiconductor laser wafer fabrication processes. The role will focus on InP BH laser fabrication, including photolithography, etching, film deposition, wafer cleaning, metrology, and process control.

Key Responsibilities

• Support InP BH laser wafer fabrication processes.
• Work with photolithography, holographic grating, film deposition, dry/wet etching, and wafer cleaning processes.
• Monitor manufacturing processes using SPC and other process-control methods.
• Troubleshoot fabrication and process issues.
• Drive continuous process and yield improvements.
• Partner with device design engineers on DOE and new process development.
• Develop metrology methods to monitor and characterize wafer processes.
• Analyze process data and prepare engineering reports.
• Support process equipment maintenance and work with equipment suppliers.
• Develop work instructions and provide technical training to production technicians.

Qualifications

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or related discipline.
• 1–3 years of semiconductor fab experience.
• Hands-on experience with:
  • Photolithography
  • Dry/wet etching
  • Wafer cleaning
• Experience with semiconductor process development, troubleshooting, and process control.
• Familiarity with characterization tools such as:
  • SEM
  • EDS
  • Ellipsometer
  • Profilometer
• Experience with III-V / InP / photonics / semiconductor laser fabrication is highly preferred.