Process Engineer III-V InP Laser Wafer Fab

Glint Tech Solutions; SOUTH PLAINFIELD (NJ); On-site; USD 90,000 - 130,000; Full time

Job summary

Glint Tech Solutions in New Jersey is seeking a Process Engineer to support and develop advanced III-V semiconductor laser wafer fabrication processes, focusing on InP BH laser fabrication, including photolithography, etching, film deposition, wafer cleaning, metrology, and process control.

The role involves troubleshooting, DOE and new process development with device design engineers, developing metrology methods, analyzing process data, and training production technicians.

Qualifications

• MS or PhD in a relevant engineering or science discipline is required.
• 1–3 years of semiconductor fab experience preferred.
• Hands-on experience with photolithography, dry/wet etching, and wafer cleaning.
• Experience in process development, troubleshooting, and process control.
• Familiarity with SEM/EDS/ellipsometry/profilometry for characterization.
• Experience with III-V/InP photonics or laser fabrication is highly preferred.

Responsibilities

• Support InP BH laser wafer fabrication processes including lithography and etching.
• Work with photolithography, holographic grating, deposition, etching, and cleaning.
• Monitor processes using SPC and other control methods.
• Troubleshoot fabrication issues and drive yield improvements.
• Collaborate with design engineers on DOE and new process development.
• Develop metrology methods and analyze process data for reports.
• Support equipment maintenance and liaise with suppliers.
• Create work instructions and train production technicians.

Skills

Photolithography

Wafer cleaning

Etching (dry/wet)

Process control

DOE/Process development

Metrology

Education

MS or Ph.D. in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or related discipline

Tools

SEM

EDS

Ellipsometer

Profilometer

Job description

Glint Tech Solutions in New Jersey is seeking a Process Engineer to support and develop advanced III-V semiconductor laser wafer fabrication processes, focusing on InP BH laser fabrication, including photolithography, etching, film deposition, wafer cleaning, metrology, and process control.

The role involves troubleshooting, DOE and new process development with device design engineers, developing metrology methods, analyzing process data, and training production technicians.