Process Engineer III - Dry Etch

FUJIFILM Holdings America Corporation; Santa Clara (CA); On-site; USD 135,000 - 165,000; Full time

Benefits offered by this job

Competitive wages

Generous benefits package

Job summary

FUJIFILM Holdings America Corporation is seeking a process engineer to develop and improve wafer fab processes in Santa Clara, California. This position involves sustaining products with cost reduction efforts and interfacing with engineering teams to solve technical challenges.

The ideal candidate will have at least 8 years of relevant experience specifically in MEMS wafer fabrication. A competitive salary ranging from $135,000 to $165,000 is offered, along with a generous benefits package.

Qualifications

• Minimum of 8 years relevant experience in a MEMS wafer fab.
• Must have experience in Plasma Etching, Ash, and photo processes.
• Ability to apply advanced mathematical concepts.

Responsibilities

• Develop and improve wafer fab processes.
• Analyze problems using wafer metrology tools.
• Solve technical product problems through project management.

Skills

Problem identification

Statistical process control (SPC)

Process and design engineering

Mathematical operations

Verbal and presentation skills

Education

Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics

Tools

Wafer metrology tools

Plasma Etching equipment

Job description

Job Description

Salary range for position: $135,000 - $165,000, commensurate with experience.

Position Summary

Develop and improve wafer fab processes. Own tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Essential Duties and Responsibilities

• Develop and improve wafer fab processes (Silicon Oxide, Deep Silicon, Ion Mill and etch processes).
• Use and run wafer metrology tools to analyze problems, failures and other technical issues.
• Use good problem solving and project management skills to solve the wide array of technical product problems.
• Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
• Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
• Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.

Supervisory Responsibilities

None

Qualifications

• Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
• Must have related experience in Plasma Etching, Ash, photo processes and related plasma chemistry.
• Ability to find root causes of wafer fab problems.
• Excellent problem identification and problem-solving skills.
• Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
• Ability to apply mathematical operations to tasks such as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
• Ability to respond to common inquiries or complaints from internal resources and customers.
• Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

Physical Demands

• Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.
• Sitting one-third to two-thirds of the time.

Work Environment

• Works in wafer fabrication and clean room environment.
• Exposure to moderate noise levels.
• May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will insure that waste containers in their work areas are properly labeled and dated. Employees will ensure that waste containers are closed after transferring waste to them. Report any incidents involving hazardous waste to supervisor.

Other

• Other duties as may be assigned.
• Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.
• Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects of these documents.

Benefits

FUJIFILM Dimatix provides competitive wages, a generous benefits package and a friendly, dynamic working environment.

Fujifilm Dimatix is an E-Verify Employer.

Equal Opportunity Employer

Equal Opportunity Employer

EEO Information

Fujifilm is committed to providing equal opportunities in hiring, promotion and advancement, compensation, benefits, and training regardless of nationality, age, gender, sexual orientation or gender identity, race, ethnicity, religion, political creed, ideology, national, or social origin, disability, veteran status, etc.

ADA Information

If you require reasonable accommodation in completing this application, interviewing, completing any pre‑employment testing, or otherwise participating in the employee selection process, please direct your inquiries to our HR Department ([e-mail]).