Process Engineer III - Dry Etch

Merck & Co.; Santa Clara (CA); On-site; USD 135,000 - 165,000; Full time

Job summary

Merck & Co. is seeking an experienced engineer to enhance wafer fab processes and provide production support for inkjet print heads. The role involves working closely with R&D and manufacturing to qualify new tools and processes.

A Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics and a minimum of 8 years experience in a MEMS wafer fab are required, alongside strong problem-solving and communication skills.

Qualifications

• Minimum of 8 years relevant experience in process and design engineering in a MEMS wafer fab.
• Experience in Plasma Etching and related processes.
• Ability to find root causes of wafer fab problems.
• Excellent written, verbal and presentation skills.

Responsibilities

• Develop and improve wafer fab processes.
• Provide production support engineering for inkjet print heads.
• Use problem-solving skills to analyze technical issues.
• Communicate effectively and motivate others to resolve problems.

Skills

Problem identification

Problem-solving skills

Communication

Mathematical concepts

Education

Bachelor's degree in Engineering, Material Science, Chemistry, or Physics

Tools

Wafer metrology tools

Statistical Process Control (SPC)

Job description

Job Description

Salary range: $135,000 - $165,000, commensurate with experience.

Position Summary

Develop and improve wafer fab processes. Own the tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Essential Duties and Responsibilities

• Develop and improve wafer fab processes (Silicon Oxide, Deep Silicon, Ion Mill, etch processes).
• Use and run wafer metrology tools to analyze problems, failures and other technical issues.
• Use problem solving and project management skills to solve the wide array of technical product problems.
• Communicate effectively and motivate others inside and outside the department to resolve problems and accomplish work through company resources.
• Organize technical problem solving strategies and present them effectively to all concerned parties.
• Use statistical process control (SPC), design of experiments (DoE) and yield data to help resolve or correct all identified problems.

Supervisory Responsibilities

None.

Qualifications

To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skill, and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Required

• Bachelor's degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
• Related experience in Plasma Etching, Ash, photo processes.
• Ability to find root causes of wafer fab problems.
• Excellent problem identification and problem‑solving skills.
• Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
• Ability to apply mathematical operations to tasks such as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
• Ability to respond to common inquiries or complaints from internal resources and customers.
• Excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and manager.

Physical Demands

• Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.
• Sitting one-third to two-thirds of the time.

Work Environment

• Works in wafer fabrication and clean room environment.
• Exposure to moderate noise levels.
• May potentially handle hazardous waste in accordance with safe work practices defined in Hazardous Communication and Hazardous Waste training programs.

Other

• Other duties as may be assigned.
• Each employee's primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers' requirements.
• Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session.
• Special attention must be given to the safety aspects of these documents.

Equal Opportunity Employer

Fujifilm Dimatix is an E‑Verify Employer. Fujifilm is committed to providing equal opportunities in hiring, promotion and advancement, compensation, benefits, and training regardless of nationality, age, gender, sexual orientation or gender identity, race, ethnicity, religion, political creed, ideology, national, or social origin, disability, veteran status, etc.

ADA Information

If you require reasonable accommodation in completing this application, interviewing, completing any pre‑employment testing or otherwise participating in the employee selection process, please direct your inquiries to our HR Department ([e-mail]).