Manufacturing Process Engineer II

FUJIFILM Dimatix, Inc.

Santa Clara (CA)

On-site

USD 110,000 - 130,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Competitive wages
Generous benefits package
Dynamic working environment

Job summary

FUJIFILM Dimatix, Inc. is seeking a skilled engineer to develop and enhance wafer fab processes for inkjet print heads. The role entails providing production support, minimizing yield loss, and collaborating with R&D and manufacturing engineers.

Applicants must hold a Bachelor’s degree in a relevant field and possess at least 5 years of experience in process and design engineering within MEMS wafer fabrication. The position offers competitive salaries and benefits.

Qualifications

  • Minimum of 5 years relevant experience in MEMS wafer fab engineering.
  • Experience in semiconductor manufacturing required.
  • Ability to find root causes of wafer fab problems.

Responsibilities

  • Develop and improve wafer fab processes.
  • Provide production support engineering for inkjet print heads.
  • Use wafer metrology tools to analyze technical issues.

Skills

Problem-solving skills
Statistical Process Control (SPC)
Technical analysis

Education

Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics

Job description

Job Description

Salary range for position: $110,000 - $130,000, commensurate with experience.

Position Summary

Develop and improve wafer fab processes. Own tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

ESSENTIAL DUTIES AND RESPONSIBILITIES
  • Develop and improve wafer fab processes working on a variety of MEMS process engineering disciplines (Photolithography, Wet Etch, Thin Films, Sputtering, PECVD, Laser Dice, Ash and Wet Strip, Bond, CMP, Bond, Dry Film, AOI, Automation Systems, FDC...)
  • Use and run wafer metrology tools to analyze problems, failures and other technical issues.
  • Use good problem solving and project management skills to solve the wide array of technical product problems.
  • Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
  • Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
  • Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.
SUPERVISORY RESPONSIBILITIES

None

QUALIFICATIONS

To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skill, and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

  • Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 5 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
  • Must have related experience in semiconductor, MEMS manufacturing...
  • Ability to find root causes of wafer fab problems.
  • Excellent problem identification and problem-solving skills.
  • Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
  • Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
  • Ability to respond to common inquiries or complaints from internal resources and customers.
  • Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.
PHYSICAL DEMANDS
  • Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.
  • Sitting one-third to two-thirds of the time.
WORK ENVIRONMENT
  • Works in wafer fabrication and clean room environment.
  • Exposure to moderate noise levels.
  • May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will insure that waste containers in their work areas are properly labeled and dated. Employees will ensure that waste containers are closed after transferring waste to them. Report any incidents involving hazardous waste to supervisor.
OTHER
  • Other duties as may be assigned.
  • Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.
  • Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects of these documents.

FUJIFILM Dimatix provides competitive wages, a generous benefits package and a friendly, dynamic working environment.

Equal Opportunity Employer. Fujifilm Dimatix is an E-Verify Employer.

EEO Information: Fujifilm is committed to providing equal opportunities in hiring, promotion and advancement, compensation, benefits, and training regardless of nationality, age, gender, sexual orientation or gender identity, race, ethnicity, religion, political creed, ideology, national, or social origin, disability, veteran status, etc.

ADA Information: If you require reasonable accommodation in completing this application, interviewing, completing any pre‑employment testing, or otherwise participating in the employee selection process, please direct your inquiries to our HR Department (fdmxbenefits@fujifilm.com).

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Manufacturing Process Engineer III
Manufacturing Process Engineer III

FUJIFILM Dimatix, Inc. • Santa Clara (CA)

On-site
USD 90,000 - 120,000
Competitive wages
Generous benefits package
Friendly working environment
Manufacturing Process Engineer III
Manufacturing Process Engineer III

Merck & Co. • Santa Clara (CA)

On-site
USD 135,000 - 165,000
Generous benefits package
Competitive wages
Process Engineer II - Dry Etch
Process Engineer II - Dry Etch

Merck & Co. • Santa Clara (CA)

On-site
USD 110,000 - 130,000
Competitive wages
Generous benefits package
Dynamic working environment
Manufacturing Process Engineer II
Manufacturing Process Engineer II

FUJIFILM Holdings America Corporation • Santa Clara (CA)

On-site
USD 110,000 - 130,000
Competitive wages
Generous benefits package
Dynamic working environment
Manufacturing Photolithography Process Engineer II
Manufacturing Photolithography Process Engineer II

FUJIFILM Dimatix, Inc. • Santa Clara (CA)

On-site
USD 110,000 - 130,000
Competitive wages
Generous benefits package
Friendly working environment
Manufacturing Process Engineer II
Manufacturing Process Engineer II

Merck & Co. • Santa Clara (CA)

On-site
USD 110,000 - 130,000
Comprehensive benefits program
Competitive wages
Support for professional development
Manufacturing Process Engineer III
Manufacturing Process Engineer III

FUJIFILM Holdings America Corporation • Santa Clara (CA)

On-site
USD 135,000 - 165,000
Generous benefits package
Competitive wages
Dynamic working environment
Process Engineer III - Dry Etch
Process Engineer III - Dry Etch

FUJIFILM Holdings America Corporation • Santa Clara (CA)

On-site
USD 135,000 - 165,000
Competitive wages
Generous benefits package
Process Engineer III - Dry Etch
Process Engineer III - Dry Etch

Merck & Co. • Santa Clara (CA)

On-site
USD 135,000 - 165,000
Manufacturing Photolithography Process Engineer III
Manufacturing Photolithography Process Engineer III

FUJIFILM Holdings America Corporation • Santa Clara (CA)

On-site
USD 135,000 - 165,000
Generous benefits package
Healthy work-life balance
Dynamic work environment