Manufacturing Process Engineer III

FUJIFILM Dimatix, Inc.; Santa Clara (CA); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Competitive wages

Generous benefits package

Friendly working environment

Job summary

FUJIFILM Dimatix, Inc. in Santa Clara, California is seeking an experienced engineer to develop and improve wafer fab MEMS processes. The role involves ensuring production support engineering for inkjet print heads, collaborating closely with R&D and manufacturing teams.

Candidates must have a Bachelor's degree in Engineering or related field with at least 8 years of experience in MEMS wafer fab. The position offers competitive wages, generous benefits, and a supportive work environment.

Qualifications

• Minimum of 8 years relevant experience in MEMS wafer fab.
• Experience in semiconductor and MEMS manufacturing.
• Ability to apply advanced mathematical concepts.

Responsibilities

• Develop and improve wafer fab MEMS processes.
• Analyze problems using wafer metrology tools.
• Communicate effectively to resolve technical issues.

Skills

Problem identification

Problem-solving skills

Statistical process control (SPC)

Data analysis using JMP, Minitab

Communication skills

Root cause analysis

Education

Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics

Job description

Position Summary

Develop and improve wafer fab MEMS processes. Own tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Essential Duties and Responsibilities

• Develop and improve wafer fab processes working on a variety of MEMS process engineering disciplines (Photolithography, Wet Etch, Thin Films, Sputtering, PECVD, Laser Dice, Ash and Wet Strip, Bond, CMP, Dry Film, AOI, Automation Systems, FDC...).
• Use and run wafer metrology tools to analyze problems, failures and other technical issues.
• Use problem‑solving and project‑management skills to solve the wide array of technical product problems.
• Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
• Organize technical problem‑solving strategies clearly and present them effectively to all concerned parties.
• Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.

Supervisory Responsibilities

• None

Qualifications

• Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
• Must have related experience in semiconductor, MEMS manufacturing, and process and design engineering work in a MEMS wafer fab.
• Ability to find root causes of wafer fab problems.
• Excellent problem identification and problem‑solving skills.
• Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
• Ability to apply mathematical operations to tasks such as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
• Ability to respond to common inquiries or complaints from internal resources and customers.
• Ability to carry out data analysis using JMP, Minitab. Green or Black Belt preferred.
• Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

Physical Demands

• Standing, walking, using hands to finger, handle or feel, and talk or hear under one‑third of the time.
• Sitting one‑third to two‑thirds of the time.

Work Environment

• Works in wafer fabrication and clean‑room environment.
• Exposure to moderate noise levels.
• May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs.

Other

• Other duties as may be assigned.
• Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.
• Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects of these documents.

FUJIFILM Dimatix provides competitive wages, a generous benefits package and a friendly, dynamic working environment.

Equal Opportunity Employer. FUJIFILM Dimatix is an E‑Verify Employer.

EEO Information

Fujifilm is committed to providing equal opportunities in hiring, promotion and advancement, compensation, benefits, and training regardless of nationality, age, gender, sexual orientation or gender identity, race, ethnicity, religion, political creed, ideology, national, or social origin, disability, veteran status, etc.

ADA Information

If you require reasonable accommodation in completing this application, interviewing, completing any pre‑employment testing, or otherwise participating in the employee selection process, please direct your inquiries to our HR Department ([e-mail]).