Process Engineer

Actalent

Beaverton (OR)

On-site

USD 100,000 - 160,000

Full time

2 days ago
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Job summary

Actalent is seeking a Process Engineer (Dry Etch) to join our Hillsboro, Oregon team, focusing on advanced dry etch processes for FEOL/BEOL. You will work on developing and optimizing RIE/plasma etch processes to meet customer needs and support device scaling from lab to high-volume manufacturing.

The role involves hands-on development, data-driven optimization, DOE-driven tuning, and cross-functional collaboration.

Qualifications

  • 5 to 15 years of experience as a Process Engineer developing processes on semiconductor manufacturing equipment.
  • Work experience with dry etch or plasma etch processes in semiconductor manufacturing or on semiconductor equipment.
  • Experience owning process development or recipe development.
  • BS or MS in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or an equivalent combination of education and work experience with cleanroom and semiconductor equipment.
  • For the Process Engineer IV level, a PhD with 3+ years, MS with 6+ years, or BS with 8+ years of relevant experience.
  • Ability to learn and understand dry etch, RIE, and plasma science at an advanced level.
  • Familiarity with a variety of metrology and characterization methods used in the semiconductor industry.
  • Strong engineering analytical and problem-solving skills with understanding of and experience with the Scientific Method.
  • In-depth understanding of Statistical Process Control (SPC) and Design of Experiments (DOE).
  • Familiarity with working in a laboratory and ability to work in a cleanroom environment for extended hours.
  • Ability to perform tasks requiring a high degree of manual dexterity, operate plasma etch systems and associated metrology equipment, and train new engineers on these toolsets
  • Strong organization and time management skills, with flexibility to adapt to shifting priorities and deadlines
  • Proactive, dependable, and able to drive projects to completion with on-time delivery of milestones
  • Excellent collaboration skills and the ability to build effective working relationships with internal and external customers, vendors, and other stakeholders
  • Ability to work overtime, shift work, or a flexible schedule as needed

Responsibilities

  • Perform hands-on process engineering development, research, and evaluation to deliver solutions that meet or exceed customer requirements for current and future semiconductor manufacturing processes.
  • Run experiments for the customer and deliver regular daily and weekly reports and presentations on results.
  • Work with a team on projects and development tasks, including data collection, analysis, and reporting to meet customer expectations.
  • Apply an understanding of plasma principles, etch fundamentals, and hardware functionality to process and project impact.
  • Create internal and external documentation for projects and products, including presentations, technical reports, and process engineering specifications.
  • Work closely with Process Technicians and Analytical Team members through the process development cycle.
  • Work within a matrix environment and interface with internal customers, managers, and teammates.
  • Quickly learn, train, and upskill on the latest equipment and technology, and maintain awareness of maintenance and lab procedures.
  • Maintain an understanding of business context, technology and industry trends, and competitor capabilities.
  • Professionally represent the company to the customer.
  • Perform all work safely and in compliance with Environmental, Health, and Safety procedures, and protect intellectual property and confidential information.
  • At the Process Engineer IV level, drive multiple projects at once with a high level of autonomy, act as a resource across the department, lead cross-team efforts and small projects, and support account and technology managers with product demos and business development activities, including interfacing with global engineering teams.

Skills

Dry etch knowledge
RIE/plasma etch understanding
DOE (Design of Experiments)
SPC (Statistical Process Control)
Analytical skills
Cross-functional collaboration
Teamwork in lab environment
Training engineers

Education

BS or MS in Chemical Engineering
BS in Materials Science
BS in Electrical Engineering
PhD with 3+ years / MS with 6+ years / BS with 8+ years (Process Engineer IV)

Tools

Plasma etch systems
Metrology equipment
Laboratory equipment
Cleanroom environment

Job description

Job Summary

The Process Engineer supports the sale of reactive ion etch (RIE, plasma etch) equipment to the semiconductor industry by providing process engineering support to cross-functional teams, demonstration labs, customer activities, and development programs. You will join one of two process engineering teams working on advanced process nodes (2nm, 14A, 10A and beyond) in FEOL and BEOL dry etch modules. The Process Development team develops advanced dry etch processes that win customer tool-of-record selections through rapid process development, optimization, and DOE-driven tuning. The Productivity team supports the ramp of high-volume manufacturing etch processes through development, sustaining, troubleshooting, and customer escalation support. Four positions are open, with the current focus on Process Development.

Process Engineer (Dry Etch)

Location: Hillsboro, Oregon (On-site)

Employment Type: Direct Hire

Job Summary

The Process Engineer supports the sale of reactive ion etch (RIE, plasma etch) equipment to the semiconductor industry by providing process engineering support to cross-functional teams, demonstration labs, customer activities, and development programs. You will join one of two process engineering teams working on advanced process nodes (2nm, 14A, 10A and beyond) in FEOL and BEOL dry etch modules. The Process Development team develops advanced dry etch processes that win customer tool-of-record selections through rapid process development, optimization, and DOE-driven tuning. The Productivity team supports the ramp of high-volume manufacturing etch processes through development, sustaining, troubleshooting, and customer escalation support. Four positions are open, with the current focus on Process Development.

Responsibilities
  • Perform hands-on process engineering development, research, and evaluation to deliver solutions that meet or exceed customer requirements for current and future semiconductor manufacturing processes
  • Run experiments for the customer and deliver regular daily and weekly reports and presentations on results
  • Work with a team on projects and development tasks, including data collection, analysis, and reporting to meet customer expectations
  • Apply an understanding of the relationships between plasma principles, etch fundamentals, and hardware functionality to process and project impact
  • Create internal and external documentation for projects and products, including presentations, technical reports, and process engineering specifications
  • Work closely with Process Technicians and Analytical Team members through the process development cycle
  • Work within a matrix environment and interface with internal customers, managers, and teammates
  • Quickly learn, train, and upskill on the latest equipment and technology, and maintain awareness of maintenance and lab procedures
  • Maintain an understanding of business context, technology and industry trends, and competitor capabilities
  • Professionally represent the company to the customer
  • Perform all work safely and in compliance with Environmental, Health, and Safety procedures, and protect intellectual property and confidential information
  • Create and maintain technical and procedural documentation and keep records for all work performed
  • At the Process Engineer IV level, drive multiple projects at once with a high level of autonomy, act as a resource across the department, lead cross-team efforts and small projects, and support account and technology managers with product demos and business development activities, including interfacing with global engineering teams
Qualifications
  • 5 to 15 years of experience as a Process Engineer developing processes on semiconductor manufacturing equipment
  • Work experience with dry etch or plasma etch processes in semiconductor manufacturing or on semiconductor equipment
  • Experience owning process development or recipe development
  • BS or MS in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or an equivalent combination of education and work experience with cleanroom and semiconductor equipment
  • For the Process Engineer IV level, a PhD with 3+ years, MS with 6+ years, or BS with 8+ years of relevant experience
  • Ability to learn and understand dry etch, RIE, and plasma science at an advanced level
  • Familiarity with a variety of metrology and characterization methods used in the semiconductor industry
  • Strong engineering analytical and problem-solving skills with understanding of and experience with the Scientific Method
  • In-depth understanding of Statistical Process Control (SPC) and Design of Experiments (DOE)
  • Familiarity with working in a laboratory and ability to work in a cleanroom environment for extended hours
  • Ability to perform tasks requiring a high degree of manual dexterity, operate plasma etch systems and associated metrology equipment, and train new engineers on these toolsets
  • Strong organization and time management skills, with flexibility to adapt to shifting priorities and deadlines
  • Proactive, dependable, and able to drive projects to completion with on-time delivery of milestones
  • Excellent collaboration skills and the ability to build effective working relationships with internal and external customers, vendors, and other stakeholders
  • Ability to work overtime, shift work, or a flexible schedule as needed
Preferred
  • 10+ years of experience with other semiconductor equipment makers, including wet etch experience, may be considered comparable
  • Experience working in a cleanroom or fab
  • Experience with thin film, deposition, or lithography processes
Work Environment or Schedule

This is an on-site role at the company office in Hillsboro, Oregon, with a cleanroom at the lab facility that you will use but not work in daily. Travel is minimal, under 5 percent, but some travel will be required for onsite customer support and training, including possible travel to Japan for specific training or projects.

Additional Information

The interview process includes a video interview with the hiring manager followed by an onsite interview with the team. A bg check and drug test are required. Applicants must be authorized to work for any employer in the United States.

Pay And Benefits

The pay range for this position is $100000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Get from Kelsey Hitachi Benefits from HR RSU note Bonus program

Workplace Type

This is a fully onsite position in Hillsboro,OR.

Application Deadline

This position is anticipated to close on Oct 7, 2026.

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Massachusetts Lie Detector: It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.

Use of Artificial Intelligence (AI): We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using

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