Process and Integration Engineer, Optoelectronics

Broadcom; Upper Macungie Township (PA); On-site; USD 109,700 - 175,500; Full time

Benefits offered by this job

Discretionary annual bonus

Stock purchase program

Paid sick leave and vacation time

Job summary

Broadcom is seeking a highly skilled Process Integration Engineer for the Optical Systems Division. This pivotal role, located in Upper Macungie Township, PA, involves optimizing the manufacturing of microelectronic laser and detector products in a fast-paced environment. Candidates should have extensive experience in thin-film deposition and a strong background in semiconductor manufacturing.

The position offers an annual base salary range of $109,700 - $175,500, along with a comprehensive benefits package including medical, dental, vision, and 401(K) matching.

Qualifications

• Minimum of 6 years of experience in semiconductor manufacturing.
• At least 4 years of hands-on experience in thin-film deposition.
• Solid understanding of vacuum physics and deposition techniques.

Responsibilities

• Lead the development, optimization, and scaling of multilayer coatings.
• Serve as the technical lead for facet coating and backend operations.
• Implement robust process control plans and perform data analysis.

Skills

Thin-film deposition

Statistical data analysis

Vacuum physics

Lean manufacturing methodologies

Communication

Education

Master's degree in Materials Science or relevant field

Tools

SPC

DOE

JMP

SQL

Tableau

Job description

Process and Integration Engineer, Optoelectronics

We are seeking a highly skilled Process Integration Engineer to join our Optical Systems Division. This position is pivotal to the efficient and profitable manufacturing of microelectronic laser and detector products. In this 100% on‑site position in our fast‑paced, 24/7 manufacturing environment, the successful candidate will serve as the technical authority for the facet coating process, driving improvements in productivity, yield, quality, and reliability across both internal operations and subcontractor facilities and will collaborate cross‑functionally to ensure operational excellence and meet critical production commitments.

Responsibilities

• Process Engineering & Optimization: Lead the development, optimization, and scaling of complex multilayer coatings (AR, HR, and passivation layers) using Ion Beam Sputtering (IBS). Design and execute experiments (DOE) to improve manufacturing efficiency and optimize batch processes.
• Technical Leadership & Operations: Serve as the technical lead for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI). Manage equipment lifecycles, from defining requirements for new tool acquisitions to leading the qualification and buyoff of engineering upgrades.
• Quality & Data Analysis: Implement robust process control plans, SPC, FMEA, and OCAP. Utilize spectroscopic ellipsometry, spectrophotometry, and AFM for metrology. Conduct deep‑dive root cause analyses and implement corrective and preventive actions (CAPA) to mitigate defects and process excursions.
• Strategic Collaboration: Partner with internal Product, Quality, and R&D teams, as well as external foundries, to align technical goals. Manage subcontractor performance across regions via remote monitoring and maintain standard operating procedures (SOPs) and technical documentation.
• Reporting: Establish KPIs and dashboards to monitor daily performance, cycle times, and process health; communicate findings through periodic report to management.

Qualifications and Skills

• Education: Master’s degree in Materials Science, or Optical, Chemical, or Electrical Engineering.
• Experience: Minimum of 6 years of experience in semiconductor manufacturing, with at least 4 years of hands‑on experience in thin‑film deposition, specifically for optoelectronic devices.
• Technical Proficiency: Solid understanding of vacuum physics and deposition techniques (IBS, ALD) and dielectric coating materials (e.g., Al²O₃, SiO₂, Ta²O₅, TiO₂, Si₃N₄).
• Analytical Skills: Strong background in statistical data analysis; proficiency with SPC, DOE, FMEA, DMAIC, and advanced tools such as JMP, SQL, and Tableau.
• Operational Knowledge: Experience with automated bar‑handling, wafer scribing and cleaving, Pick‑and‑Place (PnP), AVI tools, Burn‑in, and mechanical engineering fundamentals.
• Soft Skills: Excellent written and verbal communication, detail‑oriented problem‑solving capabilities, and a proactive, action‑oriented mindset.

Preferred

• Ph.D. in Materials Science, or Optical, Chemical, or Electrical Engineering with at least 3 years of experience in semiconductor manufacturing.
• Proven knowledge and practical application of Lean manufacturing methodologies.

Compensation And Benefits

The annual base salary range for this position is $109,700 - $175,500.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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