Process Engineer

Mesh Optical Technologies; Gardena (CA); On-site; USD 120,000 - 140,000; Full time

Benefits offered by this job

Eligibility for stock options

Comprehensive medical, vision, and dental insurance

Flexible PTO

401(k) retirement plan access

Relocation assistance

Job summary

Dormont Manufacturing Co is seeking a Process Engineer located in Gardena, California, to oversee the operation and uptime of production tools related to packaging and assembly processes. You will ensure that engineering designs are efficiently turned into products, while also optimizing process yields and minimizing downtime.

The ideal candidate has a degree in a relevant field and hands-on experience in semiconductor packaging. A competitive salary and comprehensive benefits package are offered, including stock options, medical insurance, and relocation assistance.

Qualifications

• Experience maintaining high-uptime operation of precision manufacturing tools.
• Comfortable working in a cleanroom manufacturing environment.
• Willingness to work extended hours and weekends as needed.

Responsibilities

• Own operation and uptime of production tools on the production floor.
• Design production processes from lab bench through production ramp.
• Collaborate with engineering teams to improve process flows.

Skills

Strong troubleshooting skills

Hands-on experience in semiconductor packaging

Ability to interpret process documentation

Familiarity with statistical process control

Education

B.S. or M.S. in Materials Science or related field

Tools

Flip-chip bonders

Wafer processing equipment

Plasma cleaners

Wire bonding tools

Job description

PROCESS ENGINEER

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.

Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.

RESPONSIBILITIES

• Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
• Design production processes from the lab bench through proof of concept and production ramp
• Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
• Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
• Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
• Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
• Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
• Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield

QUALIFICATIONS

• B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field
• Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
• Hands‑on experience in semiconductor packaging, assembly, or advanced manufacturing environments
• Familiarity with equipment and processes such as flip‑chip bonding, wafer processing, plasma cleaning, and wire bonding
• Ability to interpret process documentation, equipment specifications, and production data to drive consistent output
• Comfortable working in a cleanroom or controlled manufacturing environment with cross‑functional engineering teams
• Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

• Direct experience qualifying or operating production equipment in a high‑volume production environment
• Knowledge of sub-µm die‑bonding, wafer prep, and materials used in advanced packaging
• Familiarity with statistical process control and root cause analysis methods
• 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices

COMPENSATION AND BENEFITS

Pay range:
Process Engineer: $120,000.00 - $140,000.00/per year

Title and base salary are determined on a case by case basis commensurate with experience and merit.

In addition to base salary, compensation for this role includes:

• Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
• Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
• Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
• 401(k) retirement plan access.
• Relocation assistance to sunny Los Angeles.