Process and Integration Engineer, Optoelectronics

Broadcom Inc.; Upper Macungie Township (PA); On-site; USD 109,700 - 175,500; Full time

Benefits offered by this job

Annual bonus and equity grant

Medical, dental, and vision plans

401(k) company matching

Employee Stock Purchase Program

Paid Family Leave

Job summary

Broadcom Inc. is seeking a Process Integration Engineer in Upper Macungie Township, PA to lead the development and optimization of multilayer coatings. This role is essential in ensuring efficient manufacturing of microelectronic products in a 24/7 environment.

The ideal candidate has a Master’s degree in relevant fields and at least 6 years of semiconductor manufacturing experience. The position offers a competitive salary range between $109,700 – $175,500 and comprehensive benefits.

Qualifications

• Minimum of 6 years of experience in semiconductor manufacturing.
• At least 4 years of hands-on experience in thin-film deposition.
• Strong understanding of vacuum physics and deposition techniques.

Responsibilities

• Lead development and optimization of complex multilayer coatings using Ion Beam Sputtering.
• Serve as the technical lead for facet coating and backend operations.
• Implement robust process control plans and conduct root-cause analyses.

Skills

Experience in semiconductor manufacturing

Hands-on experience in thin-film deposition

Statistical data analysis

Vacuum physics and deposition techniques

Excellent communication skills

Education

Master’s degree in Materials Science, Optical, Chemical, or Electrical Engineering

Tools

SPC

DOE

FMEA

JMP

SQL

Tableau

Job description

Process and Integration Engineer – Optoelectronics

We are seeking a highly skilled Process Integration Engineer to join our Optical Systems Division. This position is pivotal to the efficient and profitable manufacturing of microelectronic laser and detector products in a 100% on‑site, 24/7 production environment. The successful candidate will serve as the technical authority for the facet coating process, driving improvements in productivity, yield, quality, and reliability across internal operations and subcontractor facilities while collaborating cross‑functionally to meet critical production commitments.

Responsibilities

• Process Engineering & Optimization
  • Lead the development, optimization, and scaling of complex multilayer coatings (AR, HR, and passivation layers) using Ion Beam Sputtering (IBS).
  • Design and execute experiments (DOE) to improve manufacturing efficiency and optimize batch processes.
• Technical Leadership & Operations
  • Serve as the technical lead for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
  • Manage equipment lifecycles, from defining requirements for new tool acquisitions to leading the qualification and buy‑off of engineering upgrades.
• Quality & Data Analysis
  • Implement robust process control plans, SPC, FMEA, and OCAP.
  • Utilize spectroscopic ellipsometry, spectrophotometry, and AFM for metrology.
  • Conduct deep‑diving root‑cause analyses and implement corrective and preventive actions (CAPA) to mitigate defects and process excursions.
• Strategic Collaboration
  • Partner with internal Product, Quality, and R&D teams, as well as external foundries, to align technical goals.
  • Manage subcontractor performance across regions via remote monitoring and maintain SOPs and technical documentation.
• Reporting
  • Establish KPIs and dashboards to monitor daily performance, cycle times, and process health; communicate findings through periodic reports to management.

Qualifications and Skills

• Education
  • Master’s degree in Materials Science, or Optical, Chemical, or Electrical Engineering.
• Experience
  • Minimum of 6 years of experience in semiconductor manufacturing, with at least 4 years of hands‑on experience in thin‑film deposition, specifically for optoelectronic devices.
• Technical Proficiency
  • Solid understanding of vacuum physics and deposition techniques (IBS, ALD) and dielectric coating materials (e.g., Al₂O₃, SiO₂, Ta₂O₅, TiO₂, Si₃N₄).
• Analytical Skills
  • Strong background in statistical data analysis; proficiency with SPC, DOE, FMEA, DMAIC, and advanced tools such as JMP, SQL, and Tableau.
• Operational Knowledge
  • Experience with automated bar‑handling, wafer scribing and cleaving, Pick‑and‑Place (PnP), AVI tools, Burn‑in, and mechanical engineering fundamentals.
• Soft Skills
  • Excellent written and verbal communication, detail‑oriented problem‑solving capabilities, and a proactive, action‑oriented mindset.
• Preferred
  • Ph.D. in Materials Science, or Optical, Chemical, or Electrical Engineering with at least 3 years of experience in semiconductor manufacturing.
  • Proven knowledge and practical application of Lean manufacturing methodologies.

About the Facility

The Breinigsville, PA, manufacturing location was created by AT&T in the late 1980s as Bell Laboratories’ world headquarters for optoelectronics. Through a series of acquisitions, this facility is now an integral part of Broadcom’s Optical Systems Division, manufacturing indium phosphide lasers and detectors that support telecommunications and datacenter customers worldwide. Located in the Lehigh Valley region of Pennsylvania just outside Allentown, the high‑volume, 24/7 facility fabricates devices that enable fiber‑optic communication and datacenter expansion.

Compensation and Benefits

• Annual base salary range: $109,700 – $175,500.
• Discretionary annual bonus and an equity grant, plus annual equity awards.
• Medical, dental, and vision plans.
• 401(k) participation with company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company‑paid holidays, paid sick leave, and vacation time.
• Paid Family Leave and other leaves of absence in compliance with applicable laws.

Equal Opportunity Employer

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside the USA, please be sure to provide a home address as this will be used for future correspondence.