Printed Circuit Board Design Engineer

Programming.com

38 hours ago

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Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
Expert-level proficiency with Cadence Allegro PCB design tools
Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules

Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.
Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
Work with PCB fabricators, and substrate vendors to close DFMs.

High-density PCB design

High-speed PCB design

Power integrity

Signal integrity

Multilayer substrates

Fine-pitch BGA

Bachelor’s degree or equivalent certifications

Cadence Allegro PCB design

The ideal candidate should have strong relevant and recent technical and hands-on background

and be able is hit the ground running as an individual contributor

Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.
Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
Work with PCB fabricators, and substrate vendors to close DFMs.
Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
Expert-level proficiency with Cadence Allegro PCB design tools
Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules