Principal Silicon Photonics Test Engineer

Coherent Corp.; Fremont (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Coherent Corp. in Fremont, CA, is seeking a lead engineer to drive die-level silicon photonics test and characterization from early device characterization through qualification and manufacturing readiness.

You will architect automated electro-optical and RF test platforms for silicon photonics devices and PICs, and develop methodologies for modulators, detectors, waveguides, and other components to improve throughput and accuracy.

Responsibilities

• Lead the development of die-level silicon photonics test and characterization strategies.
• Architect and develop automated electro-optical and RF test platforms for silicon photonics.
• Develop characterization methodologies for modulators, photodetectors, waveguides, couplers, resonators, and other active/passive components.
• Develop RF and high-speed characterization techniques, including S-parameter measurements, frequency response, electro-optical bandwidth, impedance characterization, and high-speed signal integrity measurements.
• Develop test automation, data acquisition, and analysis software using Python and/or other appropriate programming environments.
• Improve test throughput, repeatability, automation, and cost while maintaining measurement accuracy and coverage.
• Analyze characterization datasets to identify performance distributions, process sensitivities, correlations, failure mechanisms, and opportunities for improved device performance and test efficiency.
• Define test structures and characterization requirements in collaboration with the silicon photonics and design team.
• Partner with process integration, wafer fabrication, packaging, reliability, product engineering, and manufacturing teams to correlate die-level measurements with downstream package and system performance.
• Drive design-for-test (DFT) improvements and influence future device and PIC designs based on characterization results and test limitations.
• Lead root-cause investigations for complex electrical, RF, optical, and electro-optical performance issues.
• Serve as a technical mentor and coach for junior and mid-career engineers, helping
• Review test plans, measurement methodologies, automation code, data analysis, and technical conclusions produced by other engineers, providing constructive technical feedback and guidance.
• Delegate technically challenging projects in a way that develops engineering capability while maintaining appropriate technical oversight.

Job description

Job Description

Primary Duties & Responsibilities

• Lead the development of die-level silicon photonics test and characterization strategies, from early device characterization through product qualification and manufacturing readiness.
• Architect and develop automated electro-optical and RF test platforms for silicon photonic devices and photonic integrated circuits (PICs).
• Develop characterization methodologies for devices such as modulators, photodetectors, waveguides, couplers, resonators, and other passive and active photonic components.
• Develop RF and high-speed characterization techniques, including S-parameter measurements, frequency response, electro-optical bandwidth, impedance characterization, and high-speed signal integrity measurements.
• Develop test automation, data acquisition, and analysis software using Python and/or other appropriate programming environments.
• Improve test throughput, repeatability, automation, and cost while maintaining measurement accuracy and coverage.
• Analyze characterization datasets to identify performance distributions, process sensitivities, correlations, failure mechanisms, and opportunities for improved device performance and test efficiency.
• Define test structures and characterization requirements in collaboration with the silicon photonics and design team.
• Partner with process integration, wafer fabrication, packaging, reliability, product engineering, and manufacturing teams to correlate die-level measurements with downstream package and system performance.
• Drive design-for-test (DFT) improvements and influence future device and PIC designs based on characterization results and test limitations.
• Lead root-cause investigations for complex electrical, RF, optical, and electro-optical performance issues.
• Serve as a technical mentor and coach for junior and mid-career engineers, helping them develop strong fundamentals in silicon photonics, RF measurement, electro-optical characterization, and test engineering.
• Review test plans, measurement methodologies, automation code, data analysis, and technical conclusions produced by other engineers, providing constructive technical feedback and guidance.
• Delegate technically challenging projects in a way that develops engineering capability while maintaining appropriate technical oversight.

• Lead the development of die-level silicon photonics test and characterization strategies, from early device characterization through product qualification and manufacturing readiness.
• Architect and develop automated electro-optical and RF test platforms for silicon photonic devices and photonic integrated circuits (PICs).
• Develop characterization methodologies for devices such as modulators, photodetectors, waveguides, couplers, resonators, and other passive and active photonic components.
• Develop RF and high-speed characterization techniques, including S-parameter measurements, frequency response, electro-optical bandwidth, impedance characterization, and high-speed signal integrity measurements.
• Develop test automation, data acquisition, and analysis software using Python and/or other appropriate programming environments.
• Improve test throughput, repeatability, automation, and cost while maintaining measurement accuracy and coverage.
• Analyze characterization datasets to identify performance distributions, process sensitivities, correlations, failure mechanisms, and opportunities for improved device performance and test efficiency.
• Define test structures and characterization requirements in collaboration with the silicon photonics and design team.
• Partner with process integration, wafer fabrication, packaging, reliability, product engineering, and manufacturing teams to correlate die-level measurements with downstream package and system performance.
• Drive design-for-test (DFT) improvements and influence future device and PIC designs based on characterization results and test limitations.
• Lead root-cause investigations for complex electrical, RF, optical, and electro-optical performance issues.
• Serve as a technical mentor and coach for junior and mid-career engineers, helping