Principal Product Engineer

Cadence Design Systems; San Jose (CA); Hybrid; USD 140,000 - 260,000; Full time

Job summary

Cadence Design Systems in San Jose, CA seeks a Principal Product Engineer to drive the definition and early deployment of Virtuoso Heterogeneous Integration technologies. You will collaborate with Product Management, R&D, and Field teams to translate requirements into robust IC design flows for 3D IC, heterogeneous integration, and advanced packaging.

The role emphasizes customer-facing leadership, end-to-end solution ownership, and delivering PRS, use cases, and enablement materials to

Qualifications

• BS in Electrical Engineering, Electronics, or related technical field.
• 10+ years of experience in semiconductor design, physical implementation, or EDA product engineering.
• Strong communication skills across global, multicultural teams.
• Hands-on knowledge of Cadence Virtuoso and related design flows.

Responsibilities

• Drive end-to-end solutions for 3D IC, heterogeneous integration and advanced packaging flows.
• Collaborate with strategic customers to translate requirements into product specs.
• Produce high-quality PRS, use cases, and support R&D during development.
• Create demonstration materials and enablement content for adoption.
• Own delivery from definition to customer deployment with accountability.

Skills

Cadence Virtuoso expertise

3D IC / heterogeneous integration

EDA product engineering

Cross-functional collaboration

Independent / self-motivated

Education

BS in Electrical Engineering

Tools

Cadence Allegro APD+

Cadence Virtuoso SKILL language

Job description

## **At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.****Job Title: Principal Product Engineer****Location: San Jose, California, United States****Reports to: Product Engineering Director****Job Overview:**As Product Engineer, you are responsible for driving the definition, early deployment, and broader adoption of the Cadence Virtuoso Heterogeneous Integration technologies. You work with strategic customers, Product Management, R&D, Product Validation, and Application Engineering teams to define requirements, validate solutions, and accelerate customer success in physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging.**Job Responsibilities:** * Drive, validate, and promote an end-to-end solution for system design implementation flows spanning 3D IC, heterogeneous integration and advanced packaging.* Partner with leading semiconductor customers to understand complex system co-design challenges and translate them into clear product specifications.* Produce high-quality Product Requirement Specifications (PRS), technical use cases, and support R&D throughout product development.* Collaborate cross-functionally with R&D, Product Management, Field teams, Technical Publications and Product Validation to deliver robust, customer-ready capabilities.* Create and deliver demonstration collateral, application workflows, and enablement materials to accelerate customer and field adoption.* Troubleshoot design-flow issues, provide technical guidance and workarounds, and drive bug/enhancement prioritization.* Support product launches, customer engagements, and industry events.* Own deliverables from definition through customer deployment with a strong focus on execution and accountability.**Job Qualifications:** * BS in Electrical Engineering, Electronics, or a related technical field.* Strong experience in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.* Strong hands-on knowledge of the Cadence Virtuoso platform and associated custom IC design flows.* 10+ years of relevant experience, or equivalent demonstrated expertise.* Proven ability to work independently, prioritize effectively, and take responsibility for technical deliverables.* Strong verbal and written communication skills, with the ability to collaborate effectively across global and multicultural teams, and across functions.* Highly motivated by the rapidly evolving landscape of 3DIC, heterogeneous integration, and advanced packaging technologies, with a passion for driving innovation in next-generation semiconductor solutions.**Additional Skills/Preferences:*** Experience with software product definition, validation, or technical marketing activities.* Experience with co-design flows around 3D IC, heterogeneous integration, silicon-package-board integration.* Knowledge of Cadence Allegro Package Designer Plus (APD+) and package implementation methodologies.* Knowledge of Cadence Virtuoso SKILL language or any other interpreted language.**Additional Information:**Cadence is committed to equal employment opportunity and employment equity throughout all levels of the organization. We strive to attract a qualified and diverse candidate pool and encourage diversity and inclusion in the workplace. *The annual salary range for California is $140,000 to $260,000. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.*