Principal Package Design Engineer

Renesas Electronics Corporation; Tempe (AZ); On-site; USD 120,000 - 180,000; Full time

Job summary

Renesas Electronics Corporation in Tempe specializes in advanced power packaging solutions, including SiP/modules, flip-chip LGA, and multi-chip modules with substrates or embedded die/capacitors. The role focuses on designing interconnect methods, qualifying materials, and coordinating with OSAT/CM partners to ensure robust, scalable packaging for automotive, consumer, and industrial applications.

You will work with Product and Reliability teams to qualify new packages, implement DOE-driven

Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software.
• Knowledge of Cu FSM/BGBM technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Design and develop package and interconnect methods for power SiP/modules and related packaging.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Collaborate with OSAT/CM to run DOE for process optimization and establish process specs.
• Qualify new packages and processes with Product groups and Reliability team.
• Resolve process integration issues by ensuring window checks on critical steps.
• Establish production controls and monitor quality to prevent incidents.
• Ensure smooth transition into production and ramp-up monitoring.
• Monitor and resolve process issues with OSAT/CM during early production to ensure quality parts.
• Develop expertise on advances in power SiP/modules and wafer-level packaging.
• Participate in packaging roadmap development with execution focus.
• Address internal/external customer complaints with Marketing, Product, Quality, and Operations.
• Establish and maintain package design rules.

Skills

Interpersonal skills

Communication skills

Analytical skills

Presentation skills

Education

Degrees in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

SPC software

Cu FSM/BGBM technologies

Job description

Job Description

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitor to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
• Establish & maintain package design rules.

Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier.

With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.