Director, Package Design Engineering

Renesas Electronics Corp.; California (MO); On-site; USD 230,000 - 260,000; Full time

Job summary

Renesas Electronics Corp. is seeking a senior specialist in package technology development to lead NPI/R&D and OSAT management for new power packaging solutions. Focus areas include AI/datacenter power packaging, SiP/module design, and advanced interconnects.

You will work with product and reliability teams to qualify new packages and establish process specs. The role requires 15–20 years in package development, strong knowledge of wafer-level/flip-chip packaging, and excellent analytical

Qualifications

• PhD/MS/BS in physics, chemistry, mechanical, electrical, or materials engineering.
• 15–20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software.
• Knowledge of wire-bonding & multi-chip module technologies is a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Develop and drive package technology development, NPI, R&D, and OSAT management for new package development and qualification.
• Design and develop package and interconnect methods for AI/Data center power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages.
• Coordinate with OSAT/CM to benchmark, qualify materials, processes, and subcontractors.
• Lead DOE studies with OSAT/CM to optimize processes and establish process specs.
• Collaborate with Product and Reliability teams to qualify new packages and processes within timelines.
• Resolve process integration issues by ensuring window checks on critical steps.
• Establish production controls and ramp-up monitors to prevent quality incidents.
• Monitor early production issues with OSAT/CM to ensure high-quality parts.
• Build expertise in power SiP/modules, wafer-level packaging, and flip-chip interconnects; contribute to packaging roadmap.
• Participate in packaging roadmap development and execution.
• Address internal/external complaints with cross-functional teams to support business growth.
• Establish and maintain package design rules.

Skills

Power SiP/modules

Wafer-level packaging

Flip-chip packaging

SPC & statistics

Communication skills

Analytical skills

Presentation skills

Education

Doctorate/Master's/Bachelor’s in Physics, Chemistry, Mechanical, Electrical or Materials Eng

Tools

DOE

Job description

Responsibilities:

• Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
• Focus on design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitors to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
• Establish & maintain package design rules.

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

The expected annual pay range for this position is $230,000-260,000. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.