High Bandwidth Memory Design Architect - E1 to SMTS

Micron; Richardson (TX); Vor Ort; USD 140.000 - 220.000; Vollzeit

Benefits dieser Stelle

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Zusammenfassung

Micron Technology, Inc. is seeking an HBM Design Architect to drive analysis, modeling, and pathfinding for future High Bandwidth Memory products.

You will evaluate performance, power, area, thermal behavior, reliability, and manufacturability across system and block-level design tradeoffs with AI-assisted techniques. You will collaborate with architecture, circuit design, layout, packaging, product, and system teams to explore innovative memory architectures and ensure scalable,

Qualifikationen

• Degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
• Strong foundation in CMOS circuits, analog or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
• Experience developing engineering models, simulations, or analytical methodologies job experience or university-related work.
• Demonstrated ability to evaluate complex technical problems, draw evidence-based conclusions, and communicate recommendations effectively to multidisciplinary teams.
• Strong analytical, problem solving, written communication, and verbal communication skills.

Aufgaben

• Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity.
• Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches, identify design sensitivities, and support technology pathfinding.
• Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability considerations.
• Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and provide evidence-based design recommendations.
• Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation, clearly articulating assumptions, risks, and recommended actions.

Kenntnisse

CMOS circuits

Analog/mixed-signal

Memory systems

Computer architecture

Thermal sciences

Signal integrity

Power delivery

3D integration

Ausbildung

Electrical/Computer Engineering degree

Tools

HSPICE

FineSim

Spectre

circuit-design environments

Jobbeschreibung

About the Team

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron Technology, we transform how the world uses information to enrich life for all.

The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems.

The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions.

Position Overview

As an HBM Design Architect, you will contribute to analysis, modeling, and pathfinding for future High Bandwidth Memory products.

Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability.

This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making.

Responsibilities

• Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity.
• Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches, identify design sensitivities, and support technology pathfinding.
• Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability considerations.
• Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and provide evidence-based design recommendations.
• Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation, clearly articulating assumptions, risks, and recommended actions.

Minimum Qualifications

• Degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
• Strong foundation in at least two of the following areas: CMOS circuits, analog or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
• Experience developing engineering models, simulations, or analytical methodologies job experience or university-related work.
• Demonstrated ability to evaluate complex technical problems, draw evidence-based conclusions, and communicate recommendations effectively to multidisciplinary teams.
• Strong analytical, problem solving, written communication, and verbal communication skills.

Preferred Qualifications

• Work experience, graduate research, internship, thesis, dissertation, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D integration technologies.
• Experience with engineering simulation and analysis tools such as HSPICE, FineSim, Spectre, or similar circuit-design environments.
• Understanding of power, performance, area, timing, thermal, and reliability tradeoffs in advanced semiconductor designs.
• Experience using data analytics, AI, Large Language Models (LLMs), or Generative AI technologies to enhance engineering productivity, design exploration, or technical analysis.
• Technical communication experience demonstrated through publications, conference presentations, patents, research reviews, or design reports.

Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.

Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity & Diversity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.