Principal ASIC Engineer, Reliability, Hardware Validation

Jobtailor; San Jose (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Jobtailor in San Jose, CA is seeking a senior reliability and hardware design leader for next-generation semiconductor and networking products. You will define and drive qualification plans, lead HTOL, Burn-In, and stress testing, and manage cross-functional teams across design, test, and manufacturing.

The role requires 10+ years in reliability or high-speed hardware design, with deep knowledge of JEDEC/AEC/Telcordia standards.

Qualifications

• Master’s degree in electrical or computer engineering.
• 10+ years of professional experience in semiconductor reliability and/or high-speed hardware design.
• Proven experience in developing high-power HTOL/Burn-In testing for advanced node products.
• Deep knowledge of JEDEC, AEC, and Telcordia standards.
• Hands-on experience with high-speed network interfaces and board design.
• Familiarity with Cadence Allegro.
• Experience with high-speed measurement equipment and automated test development.
• Ability to interpret sophisticated schematics and layouts.
• PhD in Electrical or Computer Engineering (preferred).
• Experience with 2nm/3nm Hyperscaler Multi-Chip-Modules and advanced packaging (preferred).

Responsibilities

• Lead the reliability and hardware design validation for next-generation semiconductor and networking products.
• Bridge the gap between advanced semiconductor reliability testing and high-speed hardware board design.
• Define and execute comprehensive product/process qualification plans for high-power solutions (wafer/package level).
• Drive robust, error-free HTOL, Burn-In, and stress testing (HAST, TC, HTS, ESD, LU, SER).
• Manage reliability suppliers and subcontractors to ensure adherence to qualification schedules.
• Lead hardware design, schematic generation, and design validation for service provider routing products.
• Manage board bring-up and debug processes.
• Drive failure analysis activities and generate detailed qualification reports.
• Partner with eCAD, FPGA, Power, Mechanical, Signal Integrity, and Manufacturing teams.
• Provide technical documentation and support for customer quality and reliability requirements.

Skills

Semiconductor reliability

High-speed hardware design

HTOL/Burn-In testing

Data analysis

Signal integrity

Schematic generation

Education

Master’s degree in Electrical or Computer Engineering

PhD in Electrical or Computer Engineering (preferred)

Tools

Cadence Allegro

High-Speed Measurement Equipment

JMP

Reliasoft

Minitab

Python

Perl

TCL

Verilog

Job description

• • Lead the reliability and hardware design validation for next-generation semiconductor and networking products
• • Bridge the gap between advanced semiconductor reliability testing and high-speed hardware board design
• • Define and execute comprehensive product/process qualification plans for high-power solutions (wafer/package level)
• • Drive robust, error-free HTOL, Burn-In, and stress testing (HAST, TC, HTS, ESD, LU, SER)
• • Manage reliability suppliers and subcontractors to ensure adherence to qualification schedules
• • Lead hardware design, schematic generation, and design validation for service provider routing products
• • Manage board bring-up and debug processes
• • Drive failure analysis activities and generate detailed qualification reports
• • Partner with eCAD, FPGA, Power, Mechanical, Signal Integrity, and Manufacturing teams
• • Provide technical documentation and support for customer quality and reliability requirements

Requirements

• Master’s degree in electrical engineering, Computer Engineering, or a related field
• 10+ years of professional experience in semiconductor reliability and/or high-speed hardware design
• Proven experience in developing high-power HTOL/Burn-In testing for advanced node products
• Deep knowledge of JEDEC, AEC, and Telcordia standards
• Hands-on experience with high-speed network interfaces, board design
• Familiarity with tools such as Cadence Allegro
• Experience with high-speed measurement equipment and automated test development
• Ability to interpret sophisticated schematics and layouts
• Proficiency in data analysis/debug and HTOL set-up
• PhD in Electrical or Computer Engineering (preferred)
• Experience with 2nm/3nm Hyperscaler Multi-Chip-Modules and advanced packaging (CoWoS, SoIC, EMIB) (preferred)
• Deep expertise in >100Gbps system design, signal integrity, and power distribution (preferred)
• Knowledge of SerDes architecture (NRZ/PAM4 at 56G/112G/224G+) (preferred)
• PCIe Gen5/6, and 800G Ethernet (preferred)
• Proficiency in Python, Perl, TCL, or Verilog for scripting and automation (preferred)
• Experience with JMP, Reliasoft, or Minitab for reliability statistical analysis (preferred)
• Understanding of FMEA processes, risk assessment, and reliability lifetime modeling (preferred)

Core Competencies

Demonstrates expertise in semiconductor reliability testing and high-speed hardware design, with a strong focus on developing and executing qualification plans for high-power solutions. Proficient in managing cross-functional teams and ensuring compliance with industry standards while driving failure analysis and technical documentation.

Highest-signal resume keywords

• Semiconductor Reliability Testing
• High-Speed Hardware Design
• HTOL/Burn-In Testing
• Data Analysis/Debug
• Signal Integrity

ATS Optimization Keywords

Hard Skills

• Electrical Engineering
• High-Power Solutions
• Failure Analysis
• Schematic Generation
• Data Analysis
• Reliability Testing
• HTOL Set-Up
• FMEA Processes
• Risk Assessment
• Reliability Lifetime Modeling

Industry Keywords

• JEDEC Standards
• AEC Standards
• Telcordia Standards
• 2nm/3nm Technology
• Multi-Chip-Modules
• CoWoS
• SoIC
• EMIB
• PCIe Gen5/6
• 800G Ethernet

Tools & Technologies

• Cadence Allegro
• High-Speed Measurement Equipment
• JMP
• Reliasoft
• Minitab
• Python
• Perl
• TCL
• Verilog