Principal Application Engineer

Artifact Global; California (MO); On-site; USD 130,000 - 155,000; Full time

Benefits offered by this job

Full benefits

Relocation assistance possible

Job summary

Artifact Global is seeking a Principal Application Engineer in Irvine, California to lead KPI-driven engineering initiatives in semiconductor packaging. You will serve as the primary technical interface to leading edge clients, guiding product implementation and performance enhancements.

With 12+ years in semiconductor packaging and a Bachelor’s degree, you will manage a small team (2–4) and collaborate with sales, marketing and PD.

Qualifications

• Bachelor's degree required in a relevant engineering field.
• 12+ years of experience in semiconductor packaging or processes with people manager experience.
• Solid understanding of current and emerging packaging trends including 2.5D and 3D packaging.

Responsibilities

• Develop and evaluate KPI results and drive continuous improvement via data-driven decisions.
• Leverage semiconductor knowledge in advanced packaging (2.5D, HBM, CoWoS) to accelerate testing and development.
• Primary technical interface to leading edge clients, addressing issues related to product implementation, functionality, or performance.
• Responsible for application functions and tasks to sales, marketing, PD and other business units.
• Manage a small (2–4) Application Engineering team to achieve project deliverables.

Skills

Strong communication

Leadership

Project management

Customer-focused

Education

Bachelor's Degree in Materials Science / Chemical / Mechanical Eng

Job description

Location: Irvine, California, United States

Principal Application Engineer

ndustry: Manufacturing & Production

Job Category: Engineering - Industrial / Manufacturing

Compensation

• Base Salary - USD $130,000 to $155,000
• Full-time
• Benefits - Full
• Relocation Assistance Available - Possible for ideal candidate

Candidate Details

• 10+ to 15 years experience
• Seniority Level - Mid-Senior
• Minimum Education - Bachelor's Degree
• Willingness to Travel - Occasionally

Management Experience Required - No

Dare to learn new skills, advance in your career and make an impact at our company.

What you ll do

• Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
• Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
• Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
• Responsible for application functions and tasks to sales, marketing, PD and other business units
• Manage a small (2-4) Application Engineering team to achieve project deliverables

What makes you a good fit

• Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
• 12 years of experience in semiconductor packaging or processes with people manager experience
• Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
• Proven ability to work independently and lead technical discussions with customers
• Strong communication skills with a customer-focused, ownership-driven mindset
• Effective project and time management skills, with a consistent focus on quality and delivery
• Willingness to travel up to 10%
• Ability to take meetings with our APAC team during off-hours