Principal Analog & Mixed-Signal IC Architect

Acceler8 Talent; Massachusetts; On-site; USD 132,000 - 220,000; Full time

Job summary

Acceler8 Talent is seeking an Analog & Mixed-Signal IC Design Engineer to own foundational circuit development with broad responsibility across circuit, package, and system boundaries, ensuring a direct connection between design decisions and measured silicon.

Join early-stage semiconductor work that shapes the product and the engineering organization, with opportunities to influence architecture choices, trade-offs between power, noise, and stability, and the integration of RF, packaging, and

Qualifications

• Strong analog/mixed-signal IC fundamentals with ownership of delivered silicon or tape-outs.
• Ability to explain architecture choices and trade-offs in designs.
• Broad understanding of power, noise, linearity, stability, and reliability across the system.

Responsibilities

• Own analog and mixed-signal circuits from architecture through verification and tape-out.
• Lead silicon bring-up, characterization, and debug using measured results to improve designs.
• Resolve design trade-offs across power, noise, linearity, stability and reliability.
• Partner with RF, power, packaging, and systems engineers on integration decisions.
• Understand how package and system constraints affect circuit performance and incorporate those requirements into the design.
• Help establish design reviews, verification methods and engineering practices as the team grows.

Skills

Analog design

Circuit architecture

Noise analysis

System integration

Job description

Acceler8 Talent is seeking an Analog & Mixed-Signal IC Design Engineer to own foundational circuit development with broad responsibility across circuit, package, and system boundaries, ensuring a direct connection between design decisions and measured silicon.

Join early-stage semiconductor work that shapes the product and the engineering organization, with opportunities to influence architecture choices, trade-offs between power, noise, and stability, and the integration of RF, packaging, and